zPatch: Hybrid resistive/capacitive etextile input

Paul Strohmeier, Jarrod Knibbe, Sebastian Boring, Kasper Hornbæk

Research output: Chapter in Book/Report/Conference proceedingConference PaperOther

14 Citations (Scopus)


We present zPatch: an eTextile patch for hover, touch, and pressure input, using both resistive and capacitive sensing. zPatches are made by layering a piezo-resistive material between silver-plated ripstop, and embedding it in non-conductive fabric to form a patch. zPatches can be easily ironed onto most fabrics, in any location, enabling easy prototyping or ad hoc modifications of existing garments. We provide open-source resources for building and programming zPatches and present measures of the achievable sensing resolution of a zPatch. A pressure based targeting task demonstrated users could reliably hit pressure targets at up to 13 levels, given appropriate feedback. We demonstrate that the hybrid sensing approach reduces false activations and helps distinguish between gestures. Finally, we present example applications in which we use zPatches for controlling a music player, text entry and gaming input.

Original languageEnglish
Title of host publicationTEI'18 - Proceedings of the Twelfth International Conference on Tangible, Embedded, and Embodied Interaction
EditorsAudrey Girouard, Jakob Tholander
Place of PublicationNew York NY USA
PublisherAssociation for Computing Machinery (ACM)
Number of pages11
ISBN (Print)9781450355681
Publication statusPublished - 18 Mar 2018
Externally publishedYes
EventTangible, Embedded, and Embodied Interaction 2018 - Stockholm, Sweden
Duration: 18 Mar 201821 Mar 2018
Conference number: 12th


ConferenceTangible, Embedded, and Embodied Interaction 2018
Abbreviated titleTEI 2018
Internet address


  • ETextile
  • Hybrid sensing
  • On body input

Cite this

Strohmeier, P., Knibbe, J., Boring, S., & Hornbæk, K. (2018). zPatch: Hybrid resistive/capacitive etextile input. In A. Girouard, & J. Tholander (Eds.), TEI'18 - Proceedings of the Twelfth International Conference on Tangible, Embedded, and Embodied Interaction (pp. 188-198). Association for Computing Machinery (ACM). https://doi.org/10.1145/3173225.3173242