Abstract
Currently ultrasonic wire bonders with precision capillary tips are widely used in the packaging industry for bonding wires to ICs and circuits. However, the quality and strength of a bond are affected significantly by the vibration of the bonding capillary. It is, therefore, necessary to study the vibration characteristics of the capillary for better understanding and for developing a non-perturbative and low-cost monitoring device for improving bonding quality control. In this paper, the vibration characteristics of the capillary are presented in terms of natural frequency and vibration modes using finite-element models. The predicted displacement profile along the capillary is compared with the measurement using a non-contact laser interferometer. In general, a good agreement between the prediction and measurement is obtained, and it shows that the interferometer may be a good monitoring tool for characterization of capillary tip vibration, as well as providing a reference for other monitoring devices. JMES265
| Original language | English |
|---|---|
| Pages (from-to) | 897-903 |
| Number of pages | 7 |
| Journal | Proceedings of the Institution of Mechanical Engineers Part C: Journal of Mechanical Engineering Science |
| Volume | 221 |
| Issue number | 8 |
| DOIs | |
| Publication status | Published - Aug 2007 |
| Externally published | Yes |
Keywords
- Vibration of the capillary
- Wire bonding