A definitive understanding of the mechanism of intergranular corrosion (IGC) in under-aged (UA) Cu-containing Al-Mg-Si alloys has not been clear to date. The grain boundary microstructure and chemistry in an UA Cu-containing Al-Mg-Si alloy were characterized by coupling atom probe tomography and scanning transmission electron microscopy. The rapid formation of an ultra-thin wetting Cu layer and discrete Q-phase (Al4Cu2Mg8Si7) precipitates along the grain boundaries, and a precipitate-free zone adjacent to the grain boundaries in the UA condition contribute to IGC.
|Number of pages||5|
|Journal||Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science|
|Publication status||Published - 1 Mar 2016|