Ultrasonic weak bond evaluation in IC packaging

X. Jian; N. Guo; Steve Dixon

doi:10.1117/12.621561

Ultrasonic weak bond evaluation in IC packaging

X. Jian, N. Guo, Steve Dixon

Research output: Chapter in Book/Report/Conference proceeding › Conference Paper › Other

Abstract

Air gap such as disbond and crack can be successfully detected by ultrasonic testing. But imperfect interface evaluation is still a challenge. The challenge arises from the uncertainty of formation mechanism, boundary condition and acoustical response. In the paper, samples of structure silicon/adhesive/lead-frame, typical in IC packaging, are fabricated with two adesives, degraded through thermo cycling, examined by acoustical waveform and C-imaging, and compared to the measured optical microscopy image and the measured failure shear strength.

Original language	English
Title of host publication	Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics; Singapore; Singapore; 29 November 2004 through 1 December 2004
Pages	528-533
Number of pages	6
Volume	5852 PART II
DOIs	https://doi.org/10.1117/12.621561
Publication status	Published - 2005
Externally published	Yes
Event	International Conference on Experimental Mechanics 2004 - Singapore, Singapore Duration: 29 Nov 2004 → 1 Dec 2004 Conference number: 3rd https://www.spiedigitallibrary.org/conference-proceedings-of-spie/5852.toc (Proceedings)

Publication series

Name	Proceedings of SPIE - The International Society for Optical Engineering
Publisher	SPIE
ISSN (Print)	0277-786X

Conference

Conference	International Conference on Experimental Mechanics 2004
Abbreviated title	ICEM 2004
Country/Territory	Singapore
City	Singapore
Period	29/11/04 → 1/12/04
Internet address	https://www.spiedigitallibrary.org/conference-proceedings-of-spie/5852.toc (Proceedings)

Keywords

C-scan imaging
Failure shear strength
IC packaging
Quantification of weak bond
Weak bond

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10.1117/12.621561

Cite this

Jian, X., Guo, N., & Dixon, S. (2005). Ultrasonic weak bond evaluation in IC packaging. In Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics; Singapore; Singapore; 29 November 2004 through 1 December 2004 (Vol. 5852 PART II, pp. 528-533). (Proceedings of SPIE - The International Society for Optical Engineering). https://doi.org/10.1117/12.621561

Jian, X. ; Guo, N. ; Dixon, Steve. / Ultrasonic weak bond evaluation in IC packaging. Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics; Singapore; Singapore; 29 November 2004 through 1 December 2004. Vol. 5852 PART II 2005. pp. 528-533 (Proceedings of SPIE - The International Society for Optical Engineering).

@inproceedings{6d3e6871286f433eaf462642aee3b636,

title = "Ultrasonic weak bond evaluation in IC packaging",

abstract = "Air gap such as disbond and crack can be successfully detected by ultrasonic testing. But imperfect interface evaluation is still a challenge. The challenge arises from the uncertainty of formation mechanism, boundary condition and acoustical response. In the paper, samples of structure silicon/adhesive/lead-frame, typical in IC packaging, are fabricated with two adesives, degraded through thermo cycling, examined by acoustical waveform and C-imaging, and compared to the measured optical microscopy image and the measured failure shear strength.",

keywords = "C-scan imaging, Failure shear strength, IC packaging, Quantification of weak bond, Weak bond",

author = "X. Jian and N. Guo and Steve Dixon",

year = "2005",

doi = "10.1117/12.621561",

language = "English",

volume = "5852 PART II",

series = "Proceedings of SPIE - The International Society for Optical Engineering",

publisher = "SPIE",

pages = "528--533",

booktitle = "Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics; Singapore; Singapore; 29 November 2004 through 1 December 2004",

url = "https://www.spiedigitallibrary.org/conference-proceedings-of-spie/5852.toc",

}

Jian, X, Guo, N & Dixon, S 2005, Ultrasonic weak bond evaluation in IC packaging. in Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics; Singapore; Singapore; 29 November 2004 through 1 December 2004. vol. 5852 PART II, Proceedings of SPIE - The International Society for Optical Engineering, pp. 528-533, International Conference on Experimental Mechanics 2004, Singapore, Singapore, 29/11/04. https://doi.org/10.1117/12.621561

Ultrasonic weak bond evaluation in IC packaging. / Jian, X.; Guo, N.; Dixon, Steve.
Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics; Singapore; Singapore; 29 November 2004 through 1 December 2004. Vol. 5852 PART II 2005. p. 528-533 (Proceedings of SPIE - The International Society for Optical Engineering).

Research output: Chapter in Book/Report/Conference proceeding › Conference Paper › Other

TY - GEN

T1 - Ultrasonic weak bond evaluation in IC packaging

AU - Jian, X.

AU - Guo, N.

AU - Dixon, Steve

N1 - Conference code: 3rd

PY - 2005

Y1 - 2005

N2 - Air gap such as disbond and crack can be successfully detected by ultrasonic testing. But imperfect interface evaluation is still a challenge. The challenge arises from the uncertainty of formation mechanism, boundary condition and acoustical response. In the paper, samples of structure silicon/adhesive/lead-frame, typical in IC packaging, are fabricated with two adesives, degraded through thermo cycling, examined by acoustical waveform and C-imaging, and compared to the measured optical microscopy image and the measured failure shear strength.

AB - Air gap such as disbond and crack can be successfully detected by ultrasonic testing. But imperfect interface evaluation is still a challenge. The challenge arises from the uncertainty of formation mechanism, boundary condition and acoustical response. In the paper, samples of structure silicon/adhesive/lead-frame, typical in IC packaging, are fabricated with two adesives, degraded through thermo cycling, examined by acoustical waveform and C-imaging, and compared to the measured optical microscopy image and the measured failure shear strength.

KW - C-scan imaging

KW - Failure shear strength

KW - IC packaging

KW - Quantification of weak bond

KW - Weak bond

UR - http://www.scopus.com/inward/record.url?scp=28444482107&partnerID=8YFLogxK

U2 - 10.1117/12.621561

DO - 10.1117/12.621561

M3 - Conference Paper

AN - SCOPUS:28444482107

VL - 5852 PART II

T3 - Proceedings of SPIE - The International Society for Optical Engineering

SP - 528

EP - 533

BT - Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics; Singapore; Singapore; 29 November 2004 through 1 December 2004

T2 - International Conference on Experimental Mechanics 2004

Y2 - 29 November 2004 through 1 December 2004

ER -

Jian X, Guo N, Dixon S. Ultrasonic weak bond evaluation in IC packaging. In Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics; Singapore; Singapore; 29 November 2004 through 1 December 2004. Vol. 5852 PART II. 2005. p. 528-533. (Proceedings of SPIE - The International Society for Optical Engineering). doi: 10.1117/12.621561

Ultrasonic weak bond evaluation in IC packaging

Abstract

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Conference

Keywords

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