Ultrasonic weak bond evaluation in IC packaging

X. Jian, N. Guo, Steve Dixon

Research output: Chapter in Book/Report/Conference proceedingConference PaperOther


Air gap such as disbond and crack can be successfully detected by ultrasonic testing. But imperfect interface evaluation is still a challenge. The challenge arises from the uncertainty of formation mechanism, boundary condition and acoustical response. In the paper, samples of structure silicon/adhesive/lead-frame, typical in IC packaging, are fabricated with two adesives, degraded through thermo cycling, examined by acoustical waveform and C-imaging, and compared to the measured optical microscopy image and the measured failure shear strength.

Original languageEnglish
Title of host publicationThird International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics; Singapore; Singapore; 29 November 2004 through 1 December 2004
Number of pages6
Volume5852 PART II
Publication statusPublished - 2005
Externally publishedYes
EventInternational Conference on Experimental Mechanics 2004 - Singapore, Singapore
Duration: 29 Nov 20041 Dec 2004
Conference number: 3rd
https://www.spiedigitallibrary.org/conference-proceedings-of-spie/5852.toc (Proceedings)

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
ISSN (Print)0277-786X


ConferenceInternational Conference on Experimental Mechanics 2004
Abbreviated titleICEM 2004
Internet address


  • C-scan imaging
  • Failure shear strength
  • IC packaging
  • Quantification of weak bond
  • Weak bond

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