Ultrasonic weak bond evaluation in IC packaging

X. Jian, N. Guo, S. Dixon, K. T.V. Grattan

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1 Citation (Scopus)


The evaluation of weak bonds within an IC package has been investigated in this paper. Samples of IC packaging have been fabricated containing structures of the die (silicon)/die-attach (silver-based adhesive)/lead frame (copper), which are typically found in IC packaging, and are degraded, to various extents, through thermal cycling to obtain varied levels of bond degradation. Interface reflection ultrasonic waveforms have been measured using a spherically focused transducer and C-scan imaging is carried out, with the results explained using an interface spring model. The ultrasonic waveforms and images obtained clearly match the thermal-cycling history, the failure shear stress measurements and the results of optical microscopy reasonably well.

Original languageEnglish
Article number015
Pages (from-to)2637-2642
Number of pages6
JournalMeasurement Science and Technology
Issue number10
Publication statusPublished - 1 Oct 2006
Externally publishedYes


  • C-scan imaging
  • Failure shear strength
  • IC packaging
  • Weak bond

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