Ultrasonic weak bond evaluation in IC packaging

X. Jian; N. Guo; S. Dixon; K. T.V. Grattan

doi:10.1088/0957-0233/17/10/015

Ultrasonic weak bond evaluation in IC packaging

X. Jian, N. Guo, S. Dixon, K. T.V. Grattan

Research output: Contribution to journal › Article › Research › peer-review

1 Citation (Scopus)

Abstract

The evaluation of weak bonds within an IC package has been investigated in this paper. Samples of IC packaging have been fabricated containing structures of the die (silicon)/die-attach (silver-based adhesive)/lead frame (copper), which are typically found in IC packaging, and are degraded, to various extents, through thermal cycling to obtain varied levels of bond degradation. Interface reflection ultrasonic waveforms have been measured using a spherically focused transducer and C-scan imaging is carried out, with the results explained using an interface spring model. The ultrasonic waveforms and images obtained clearly match the thermal-cycling history, the failure shear stress measurements and the results of optical microscopy reasonably well.

Original language	English
Article number	015
Pages (from-to)	2637-2642
Number of pages	6
Journal	Measurement Science and Technology
Volume	17
Issue number	10
DOIs	https://doi.org/10.1088/0957-0233/17/10/015
Publication status	Published - 1 Oct 2006
Externally published	Yes

Keywords

C-scan imaging
Failure shear strength
IC packaging
Weak bond

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10.1088/0957-0233/17/10/015

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title = "Ultrasonic weak bond evaluation in IC packaging",

abstract = "The evaluation of weak bonds within an IC package has been investigated in this paper. Samples of IC packaging have been fabricated containing structures of the die (silicon)/die-attach (silver-based adhesive)/lead frame (copper), which are typically found in IC packaging, and are degraded, to various extents, through thermal cycling to obtain varied levels of bond degradation. Interface reflection ultrasonic waveforms have been measured using a spherically focused transducer and C-scan imaging is carried out, with the results explained using an interface spring model. The ultrasonic waveforms and images obtained clearly match the thermal-cycling history, the failure shear stress measurements and the results of optical microscopy reasonably well.",

keywords = "C-scan imaging, Failure shear strength, IC packaging, Weak bond",

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AU - Jian, X.

AU - Guo, N.

AU - Dixon, S.

AU - Grattan, K. T.V.

PY - 2006/10/1

Y1 - 2006/10/1

N2 - The evaluation of weak bonds within an IC package has been investigated in this paper. Samples of IC packaging have been fabricated containing structures of the die (silicon)/die-attach (silver-based adhesive)/lead frame (copper), which are typically found in IC packaging, and are degraded, to various extents, through thermal cycling to obtain varied levels of bond degradation. Interface reflection ultrasonic waveforms have been measured using a spherically focused transducer and C-scan imaging is carried out, with the results explained using an interface spring model. The ultrasonic waveforms and images obtained clearly match the thermal-cycling history, the failure shear stress measurements and the results of optical microscopy reasonably well.

AB - The evaluation of weak bonds within an IC package has been investigated in this paper. Samples of IC packaging have been fabricated containing structures of the die (silicon)/die-attach (silver-based adhesive)/lead frame (copper), which are typically found in IC packaging, and are degraded, to various extents, through thermal cycling to obtain varied levels of bond degradation. Interface reflection ultrasonic waveforms have been measured using a spherically focused transducer and C-scan imaging is carried out, with the results explained using an interface spring model. The ultrasonic waveforms and images obtained clearly match the thermal-cycling history, the failure shear stress measurements and the results of optical microscopy reasonably well.

KW - C-scan imaging

KW - Failure shear strength

KW - IC packaging

KW - Weak bond

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Ultrasonic weak bond evaluation in IC packaging

Abstract

Keywords

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