Three-dimensional imaging of nano-voids in copper interconnects using incoherent bright field (IBF) tomography

P. A. Ercius, D. A. Muller, M. Weyland, L. M. Gignac

Research output: Contribution to journalArticleOtherpeer-review

Original languageEnglish
Pages (from-to)1554-1555
Number of pages2
JournalMicroscopy and Microanalysis
Issue numberSUPPL. 2
Publication statusPublished - 1 Aug 2006
Externally publishedYes

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