Three-dimensional imaging of nano-voids in copper interconnects using incoherent bright field (IBF) tomography

Peter Ercius, David A. Muller, Matthew Weyland, Lynne M. Gignac

Research output: Chapter in Book/Report/Conference proceedingConference PaperResearchpeer-review

Abstract

Conventional transmission electron microscopies are currently used to investigate the fine detail (5-50nm) of microelectronics but are inadequate for imaging complicated interconnect structures due to the overlap of features in projection. Electron tomography is a technique that extracts the lost information in the projection direction from a tilt series of images assuming a monotonic relationship between thickness and image intensity. Typical imaging techniques applied in transmission electron microscopy produce a non-linear and non-monotonic dependence of intensity on thickness making them inadequate for electron tomography. We report on the use of an incoherent bright field imaging technique in a scanning transmission electron microscope optimized for the three-dimensional reconstruction of thick copper interconnect and via structures. Linearity of the signal in samples up to ∼μm thick allows us to quantitatively reconstruct and quantify structures in three dimensions.

Original languageEnglish
Title of host publicationAdvanced Metallization Conference 2006, AMC 2006
Pages163-169
Number of pages7
Publication statusPublished - 1 Dec 2006
Externally publishedYes
Event23rd Annual Advanced Metallization Conference, AMC 2006 - San Diego, United States of America
Duration: 17 Oct 200619 Oct 2006

Publication series

NameAdvanced Metallization Conference (AMC)
Volume2006
ISSN (Print)1540-1766

Conference

Conference23rd Annual Advanced Metallization Conference, AMC 2006
CountryUnited States of America
CitySan Diego
Period17/10/0619/10/06

Cite this

Ercius, P., Muller, D. A., Weyland, M., & Gignac, L. M. (2006). Three-dimensional imaging of nano-voids in copper interconnects using incoherent bright field (IBF) tomography. In Advanced Metallization Conference 2006, AMC 2006 (pp. 163-169). (Advanced Metallization Conference (AMC); Vol. 2006).