@inproceedings{ccebdea9f33b418f887f6c8c554bda10,
title = "Three-dimensional imaging of nano-voids in copper interconnects using incoherent bright field (IBF) tomography",
abstract = "Conventional transmission electron microscopies are currently used to investigate the fine detail (5-50nm) of microelectronics but are inadequate for imaging complicated interconnect structures due to the overlap of features in projection. Electron tomography is a technique that extracts the lost information in the projection direction from a tilt series of images assuming a monotonic relationship between thickness and image intensity. Typical imaging techniques applied in transmission electron microscopy produce a non-linear and non-monotonic dependence of intensity on thickness making them inadequate for electron tomography. We report on the use of an incoherent bright field imaging technique in a scanning transmission electron microscope optimized for the three-dimensional reconstruction of thick copper interconnect and via structures. Linearity of the signal in samples up to ∼μm thick allows us to quantitatively reconstruct and quantify structures in three dimensions.",
author = "Peter Ercius and Muller, {David A.} and Matthew Weyland and Gignac, {Lynne M.}",
year = "2006",
month = dec,
day = "1",
language = "English",
isbn = "1558999477",
series = "Advanced Metallization Conference (AMC)",
pages = "163--169",
booktitle = "Advanced Metallization Conference 2006, AMC 2006",
note = "23rd Annual Advanced Metallization Conference, AMC 2006 ; Conference date: 17-10-2006 Through 19-10-2006",
}