Three dimensional imaging of electrical trees in micro and nano-filled epoxy resin

Roger Schurch; Simon M. Rowland; Robert S. Bradley; Teruo Hashimoto; George E. Thompson; Philip J. Withers

doi:10.1109/CEIDP.2014.6995882

Three dimensional imaging of electrical trees in micro and nano-filled epoxy resin

Roger Schurch
, Simon M. Rowland
, Robert S. Bradley
, Teruo Hashimoto
, George E. Thompson
, Philip J. Withers

Research output: Chapter in Book/Report/Conference proceeding › Conference Paper › Other

8 Citations (Scopus)

Abstract

The authors have previously shown that electrical trees in unfilled polymers can be three-dimensionally (3D) imaged using X-ray computed tomography (XCT) or serial block-face scanning electron microscopy (SBFSEM). Here, we present the results of 3D imaging and analysis of electrical trees in filled epoxy systems for the first time. Electrical trees created in unfilled, micro silica-filled and nano silica-filled epoxy resin were scanned using XCT at the Diamond Light Source synchrotron and then also imaged using SBFSEM. 3D virtual replicas of the trees have been generated and their structures characterised. Imaging in micro-filled epoxy is more challenging than in nano-filled epoxy. It was found that trees in samples filled up to 20 wt% with micro silica can be imaged using either XCT or SBFSEM. In the case considered, the mean diameter of tree channels in micro-filled epoxy was found to be considerably smaller (0.6 μm) than in unfilled or nano-filled epoxies (3 μm).

Original language	English
Title of host publication	2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2014
Publisher	IEEE, Institute of Electrical and Electronics Engineers
Pages	39-42
Number of pages	4
ISBN (Electronic)	9781479975235
DOIs	https://doi.org/10.1109/CEIDP.2014.6995882
Publication status	Published - 22 Dec 2014
Externally published	Yes
Event	IEEE Annual Report Conference on Electrical Insulation and Dielectric Phenomena (CEIDP) 2014 - Des Moines, United States of America Duration: 19 Oct 2014 → 22 Oct 2014 https://ieeexplore.ieee.org/xpl/conhome/6979383/proceeding (Proceedings)

Conference

Conference	IEEE Annual Report Conference on Electrical Insulation and Dielectric Phenomena (CEIDP) 2014
Abbreviated title	CEIDP 2014
Country/Territory	United States of America
City	Des Moines
Period	19/10/14 → 22/10/14
Internet address	https://ieeexplore.ieee.org/xpl/conhome/6979383/proceeding (Proceedings)

Access to Document

10.1109/CEIDP.2014.6995882

Cite this

Schurch, R., Rowland, S. M., Bradley, R. S., Hashimoto, T., Thompson, G. E., & Withers, P. J. (2014). Three dimensional imaging of electrical trees in micro and nano-filled epoxy resin. In 2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2014 (pp. 39-42). Article 6995882 IEEE, Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/CEIDP.2014.6995882

@inproceedings{dc9fb14de129420a8423fc3b7d53cdbc,

title = "Three dimensional imaging of electrical trees in micro and nano-filled epoxy resin",

abstract = "The authors have previously shown that electrical trees in unfilled polymers can be three-dimensionally (3D) imaged using X-ray computed tomography (XCT) or serial block-face scanning electron microscopy (SBFSEM). Here, we present the results of 3D imaging and analysis of electrical trees in filled epoxy systems for the first time. Electrical trees created in unfilled, micro silica-filled and nano silica-filled epoxy resin were scanned using XCT at the Diamond Light Source synchrotron and then also imaged using SBFSEM. 3D virtual replicas of the trees have been generated and their structures characterised. Imaging in micro-filled epoxy is more challenging than in nano-filled epoxy. It was found that trees in samples filled up to 20 wt\% with micro silica can be imaged using either XCT or SBFSEM. In the case considered, the mean diameter of tree channels in micro-filled epoxy was found to be considerably smaller (0.6 μm) than in unfilled or nano-filled epoxies (3 μm).",

author = "Roger Schurch and Rowland, \{Simon M.\} and Bradley, \{Robert S.\} and Teruo Hashimoto and Thompson, \{George E.\} and Withers, \{Philip J.\}",

note = "Publisher Copyright: {\textcopyright} 2014 IEEE.; IEEE Annual Report Conference on Electrical Insulation and Dielectric Phenomena (CEIDP) 2014, CEIDP 2014 ; Conference date: 19-10-2014 Through 22-10-2014",

year = "2014",

month = dec,

day = "22",

doi = "10.1109/CEIDP.2014.6995882",

language = "English",

pages = "39--42",

booktitle = "2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2014",

publisher = "IEEE, Institute of Electrical and Electronics Engineers",

address = "United States of America",

url = "https://ieeexplore.ieee.org/xpl/conhome/6979383/proceeding",

}

Schurch, R, Rowland, SM, Bradley, RS, Hashimoto, T, Thompson, GE & Withers, PJ 2014, Three dimensional imaging of electrical trees in micro and nano-filled epoxy resin. in 2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2014., 6995882, IEEE, Institute of Electrical and Electronics Engineers, pp. 39-42, IEEE Annual Report Conference on Electrical Insulation and Dielectric Phenomena (CEIDP) 2014, Des Moines, Iowa, United States of America, 19/10/14. https://doi.org/10.1109/CEIDP.2014.6995882

Three dimensional imaging of electrical trees in micro and nano-filled epoxy resin. / Schurch, Roger; Rowland, Simon M.; Bradley, Robert S. et al.
2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2014. IEEE, Institute of Electrical and Electronics Engineers, 2014. p. 39-42 6995882.

Research output: Chapter in Book/Report/Conference proceeding › Conference Paper › Other

TY - GEN

T1 - Three dimensional imaging of electrical trees in micro and nano-filled epoxy resin

AU - Schurch, Roger

AU - Rowland, Simon M.

AU - Bradley, Robert S.

AU - Hashimoto, Teruo

AU - Thompson, George E.

AU - Withers, Philip J.

PY - 2014/12/22

Y1 - 2014/12/22

N2 - The authors have previously shown that electrical trees in unfilled polymers can be three-dimensionally (3D) imaged using X-ray computed tomography (XCT) or serial block-face scanning electron microscopy (SBFSEM). Here, we present the results of 3D imaging and analysis of electrical trees in filled epoxy systems for the first time. Electrical trees created in unfilled, micro silica-filled and nano silica-filled epoxy resin were scanned using XCT at the Diamond Light Source synchrotron and then also imaged using SBFSEM. 3D virtual replicas of the trees have been generated and their structures characterised. Imaging in micro-filled epoxy is more challenging than in nano-filled epoxy. It was found that trees in samples filled up to 20 wt% with micro silica can be imaged using either XCT or SBFSEM. In the case considered, the mean diameter of tree channels in micro-filled epoxy was found to be considerably smaller (0.6 μm) than in unfilled or nano-filled epoxies (3 μm).

AB - The authors have previously shown that electrical trees in unfilled polymers can be three-dimensionally (3D) imaged using X-ray computed tomography (XCT) or serial block-face scanning electron microscopy (SBFSEM). Here, we present the results of 3D imaging and analysis of electrical trees in filled epoxy systems for the first time. Electrical trees created in unfilled, micro silica-filled and nano silica-filled epoxy resin were scanned using XCT at the Diamond Light Source synchrotron and then also imaged using SBFSEM. 3D virtual replicas of the trees have been generated and their structures characterised. Imaging in micro-filled epoxy is more challenging than in nano-filled epoxy. It was found that trees in samples filled up to 20 wt% with micro silica can be imaged using either XCT or SBFSEM. In the case considered, the mean diameter of tree channels in micro-filled epoxy was found to be considerably smaller (0.6 μm) than in unfilled or nano-filled epoxies (3 μm).

UR - https://www.scopus.com/pages/publications/84936751081

U2 - 10.1109/CEIDP.2014.6995882

DO - 10.1109/CEIDP.2014.6995882

M3 - Conference Paper

AN - SCOPUS:84936751081

SP - 39

EP - 42

BT - 2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2014

PB - IEEE, Institute of Electrical and Electronics Engineers

T2 - IEEE Annual Report Conference on Electrical Insulation and Dielectric Phenomena (CEIDP) 2014

Y2 - 19 October 2014 through 22 October 2014

ER -

Three dimensional imaging of electrical trees in micro and nano-filled epoxy resin

Abstract

Conference

Access to Document

Other files and links

Cite this