Thermal stability of ultrafine-grained copper during high speed micro-extrusion

Research output: Contribution to journalArticleResearchpeer-review

Original languageEnglish
Pages (from-to)1791 - 1799
Number of pages9
JournalMaterials Science and Engineering A: Structural Materials: Properties, Microstructure and Processing
Volume527
Issue number7-8
DOIs
Publication statusPublished - 2010

Cite this

@article{2ffc5ed3e064424a80e5bb7bd850854b,
title = "Thermal stability of ultrafine-grained copper during high speed micro-extrusion",
author = "Chengfan Gu and Davies, {Chris Huw John}",
year = "2010",
doi = "10.1016/j.msea.2009.11.005",
language = "English",
volume = "527",
pages = "1791 -- 1799",
journal = "Materials Science and Engineering A: Structural Materials: Properties, Microstructure and Processing",
issn = "0921-5093",
publisher = "Elsevier",
number = "7-8",

}

Thermal stability of ultrafine-grained copper during high speed micro-extrusion. / Gu, Chengfan; Davies, Chris Huw John.

In: Materials Science and Engineering A: Structural Materials: Properties, Microstructure and Processing, Vol. 527, No. 7-8, 2010, p. 1791 - 1799.

Research output: Contribution to journalArticleResearchpeer-review

TY - JOUR

T1 - Thermal stability of ultrafine-grained copper during high speed micro-extrusion

AU - Gu, Chengfan

AU - Davies, Chris Huw John

PY - 2010

Y1 - 2010

UR - http://www.elsevier.com/locate/msea

U2 - 10.1016/j.msea.2009.11.005

DO - 10.1016/j.msea.2009.11.005

M3 - Article

VL - 527

SP - 1791

EP - 1799

JO - Materials Science and Engineering A: Structural Materials: Properties, Microstructure and Processing

JF - Materials Science and Engineering A: Structural Materials: Properties, Microstructure and Processing

SN - 0921-5093

IS - 7-8

ER -