Thermal stability of ultrafine-grained copper during high speed micro-extrusion

TY - JOUR

T1 - Thermal stability of ultrafine-grained copper during high speed micro-extrusion

AU - Gu, Chengfan

AU - Davies, Chris Huw John

PY - 2010

Y1 - 2010

UR - http://www.elsevier.com/locate/msea

U2 - 10.1016/j.msea.2009.11.005

DO - 10.1016/j.msea.2009.11.005

M3 - Article

SN - 0921-5093

VL - 527

SP - 1791

EP - 1799

JO - Materials Science and Engineering A: Structural Materials: Properties, Microstructure and Processing

JF - Materials Science and Engineering A: Structural Materials: Properties, Microstructure and Processing

IS - 7-8

ER -