The role of optical interconnects in the design of data center architectures

A. Siokis, K. Christodoulopoulos, E. Varvarigos

Research output: Chapter in Book/Report/Conference proceedingChapter (Book)Researchpeer-review

Abstract

Optics have already found their way inside the data center (DC) by replacing electrical links for rack-to-rack interconnections. To cope with both the energy and bandwidth requirements, and to overcome the limitations of the electrical interconnects, DCs will have to deploy optical technologies not only in rack-to-rack but also in smaller packaging modules and lower levels of their architectures, namely board-to-board, on-board, and even on-chip. In this chapter the architectures proposed for these packaging levels are briefly surveyed. Implementing and laying out complex topologies via optical waveguides on the on-board (Optical Printed Circuit Boards) level presents a number of issues that have to be considered when designing architectures for DCs. To address these issues, we outline appropriate and general lay-out strategies for both point-to-point and multi-point topologies for OPCBs.
Original languageEnglish
Title of host publicationOptical Interconnects for Data Centers
EditorsTolga Tekin, Richard Pitwon, Andreas Hakansson, Nikos Pleros
Place of PublicationDuxford UK
PublisherWoodhead Publishing Limited
Chapter15
Pages375-392
Number of pages19
Edition1st
ISBN (Electronic)9780081005132
ISBN (Print)9780081005125
DOIs
Publication statusPublished - 2017
Externally publishedYes

Publication series

NameWoodhead Publishing Series in Electronic and Optical Materials
PublisherWoodhead Publishing Limited
Volume90

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