The influence of copper additions and aging on the microstructure and metastable pitting of Al-Mg-Si alloys

S.K. Kairy, P.A. Rometsch, C.H.J. Davies, N. Birbilis

Research output: Contribution to journalArticleResearchpeer-review

10 Citations (Scopus)

Abstract

The metastable pitting of 6xxx series aluminum alloys (Al-Mg-Si-(Cu)) as a function of Cu content and aging was studied. Potentiodynamic polarization and potentiostatic transients were performed to determine the electrochemical response of a family of 6xxx alloys based on a similar Si:Mg ratio. Additionally, the evolution of microstructure in all samples studied was also determined using transmission electron microscopy. The refinement in thickness of precipitates with the addition of Cu was shown to decrease the propensity for metastable pitting.
Original languageEnglish
Pages (from-to)1304 - 1307
Number of pages4
JournalCorrosion
Volume71
Issue number11
DOIs
Publication statusPublished - 2015

Cite this