Texture and Boundary Characteristics of Severely Deformed and Recrystallized Copper

Chris Huw John Davies; Wenquan Cao; Chengfan Gu; Rimma Ye Lapovok; Elena Pereloma

Texture and Boundary Characteristics of Severely Deformed and Recrystallized Copper

Chris Huw John Davies, Wenquan Cao, Chengfan Gu, Rimma Ye Lapovok, Elena Pereloma

Materials Science & Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference Paper › Research › peer-review

Original language	English
Title of host publication	Recrystallization and Grain Growth III, Materials Science Forum
Editors	S J L Kang, M Y Huh, N M Hwang, H Homma, K Ushioda, Y Ikuhara
Place of Publication	Switzerland
Publisher	Trans Tech Publications
Pages	177 - 182
Number of pages	6
Publication status	Published - 2007
Event	International Conference on Recrystallization and Grain Growth, ReX and GG 2007 - Jeju Island, Korea, South Duration: 10 Jun 2007 → 15 Jun 2007 Conference number: 3rd

Publication series

Name	Materials Science Forum
Publisher	Trans Tech Publications
Volume	558-559
ISSN (Print)	0255-5476
ISSN (Electronic)	1662-9752

Conference

Conference	International Conference on Recrystallization and Grain Growth, ReX and GG 2007
Abbreviated title	ReX and GG 2007
Country/Territory	Korea, South
City	Jeju Island
Period	10/06/07 → 15/06/07

Cite this

Davies, C. H. J., Cao, W., Gu, C., Lapovok, R. Y., & Pereloma, E. (2007). Texture and Boundary Characteristics of Severely Deformed and Recrystallized Copper. In S. J. L. Kang, M. Y. Huh, N. M. Hwang, H. Homma, K. Ushioda, & Y. Ikuhara (Eds.), Recrystallization and Grain Growth III, Materials Science Forum (pp. 177 - 182). (Materials Science Forum; Vol. 558-559). Trans Tech Publications.

Davies, Chris Huw John ; Cao, Wenquan ; Gu, Chengfan et al. / Texture and Boundary Characteristics of Severely Deformed and Recrystallized Copper. Recrystallization and Grain Growth III, Materials Science Forum. editor / S J L Kang ; M Y Huh ; N M Hwang ; H Homma ; K Ushioda ; Y Ikuhara. Switzerland : Trans Tech Publications, 2007. pp. 177 - 182 (Materials Science Forum).

@inproceedings{0221d27ab55c45678984b28af7e937a7,

title = "Texture and Boundary Characteristics of Severely Deformed and Recrystallized Copper",

author = "Davies, {Chris Huw John} and Wenquan Cao and Chengfan Gu and Lapovok, {Rimma Ye} and Elena Pereloma",

year = "2007",

language = "English",

series = "Materials Science Forum",

publisher = "Trans Tech Publications",

pages = "177 -- 182",

editor = "Kang, {S J L} and Huh, {M Y} and Hwang, {N M} and H Homma and K Ushioda and Y Ikuhara",

booktitle = "Recrystallization and Grain Growth III, Materials Science Forum",

address = "Switzerland",

note = "International Conference on Recrystallization and Grain Growth, ReX and GG 2007, ReX and GG 2007 ; Conference date: 10-06-2007 Through 15-06-2007",

}

Davies, CHJ, Cao, W, Gu, C, Lapovok, RY & Pereloma, E 2007, Texture and Boundary Characteristics of Severely Deformed and Recrystallized Copper. in SJL Kang, MY Huh, NM Hwang, H Homma, K Ushioda & Y Ikuhara (eds), Recrystallization and Grain Growth III, Materials Science Forum. Materials Science Forum, vol. 558-559, Trans Tech Publications, Switzerland, pp. 177 - 182, International Conference on Recrystallization and Grain Growth, ReX and GG 2007, Jeju Island, Korea, South, 10/06/07.

Texture and Boundary Characteristics of Severely Deformed and Recrystallized Copper. / Davies, Chris Huw John; Cao, Wenquan; Gu, Chengfan et al.
Recrystallization and Grain Growth III, Materials Science Forum. ed. / S J L Kang; M Y Huh; N M Hwang; H Homma; K Ushioda; Y Ikuhara. Switzerland: Trans Tech Publications, 2007. p. 177 - 182 (Materials Science Forum; Vol. 558-559).

Research output: Chapter in Book/Report/Conference proceeding › Conference Paper › Research › peer-review

TY - GEN

T1 - Texture and Boundary Characteristics of Severely Deformed and Recrystallized Copper

AU - Davies, Chris Huw John

AU - Cao, Wenquan

AU - Gu, Chengfan

AU - Lapovok, Rimma Ye

AU - Pereloma, Elena

N1 - Conference code: 3rd

PY - 2007

Y1 - 2007

M3 - Conference Paper

T3 - Materials Science Forum

SP - 177

EP - 182

BT - Recrystallization and Grain Growth III, Materials Science Forum

A2 - Kang, S J L

A2 - Huh, M Y

A2 - Hwang, N M

A2 - Homma, H

A2 - Ushioda, K

A2 - Ikuhara, Y

PB - Trans Tech Publications

CY - Switzerland

T2 - International Conference on Recrystallization and Grain Growth, ReX and GG 2007

Y2 - 10 June 2007 through 15 June 2007

ER -