Superhydrophobicity-mediated electrochemical reaction along the solid-liquid-gas triphase interface: edge-growth of gold architectures

A superhydrophobic pillar‐structured electrode leads to uncommon electrochemical behavior. The anti‐wetting reaction surface restricts the contact between electrolyte and electrode to the pillar tops, as a result of trapped air pockets in the gaps between pillars. The electrochemical reaction occurs mainly at the solid/liquid/gas triphase interface, instead of the traditional solid/liquid diphase surface, yielding unique edge‐growth structures — for example gold microflowers — on the top of each pillar.