Process analysis of adhesive bonding for composite Pi-joints

Patryk Burka; Xiaolin Liu; John Sheridan; Mark Thompson

Process analysis of adhesive bonding for composite Pi-joints

Patryk Burka
, Xiaolin Liu
, John Sheridan
, Mark Thompson

Mechanical & Aerospace Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference Paper › Other

1 Citation (Scopus)

Abstract

In the present paper, the flow of adhesives in composite Pi-joints is investigated numerically and experimentally. A model is developed to simulate the flow process using a computational fluid dynamics code. The results from this model are validated against matching experimental work. The viscosities of a number of adhesives were measured and found to be Non-Newtonian in character. A Non-Newtonian power law approach was found to represent the adhesives' viscosities very well. Based on the rheological data a material model was developed and implemented in the numerical code. The numerical predictions and the experimental results were found to be in good agreement. The model developed can be used to investigate the effect of various process parameters, such as insertion speed, insertion force and adhesive viscosity on output variables, including insertion force and the pressure distribution in the Pi-slot. The numerical model enables relatively simple investigations of process parameters, thus providing an efficient and useful tool to guide the bonding process design and control.

Original language	English
Title of host publication	Progress of Composites 2008 in Asia and Australasia - Proceedings of the 6th Asian-Australasian Conference on Composite Materials, ACCM 2008
Pages	192-196
Number of pages	5
Publication status	Published - 1 Dec 2008
Event	Asian-Australian Conference on Composite Materials 2008 - Kumamoto, Kyushu, Japan Duration: 23 Sept 2008 → 26 Sept 2008 Conference number: 6th

Publication series

Name	Progress of Composites 2008 in Asia and Australasia - Proceedings of the 6th Asian-Australasian Conference on Composite Materials, ACCM 2008

Conference

Conference	Asian-Australian Conference on Composite Materials 2008
Abbreviated title	ACCM 2008
Country/Territory	Japan
City	Kumamoto, Kyushu
Period	23/09/08 → 26/09/08

Keywords

Adhesive bonding
Composite joint
Non-Newtonian viscosities
Power law model
Process simulation

Cite this

Burka, P., Liu, X., Sheridan, J., & Thompson, M. (2008). Process analysis of adhesive bonding for composite Pi-joints. In Progress of Composites 2008 in Asia and Australasia - Proceedings of the 6th Asian-Australasian Conference on Composite Materials, ACCM 2008 (pp. 192-196). (Progress of Composites 2008 in Asia and Australasia - Proceedings of the 6th Asian-Australasian Conference on Composite Materials, ACCM 2008).

Burka, Patryk ; Liu, Xiaolin ; Sheridan, John et al. / Process analysis of adhesive bonding for composite Pi-joints. Progress of Composites 2008 in Asia and Australasia - Proceedings of the 6th Asian-Australasian Conference on Composite Materials, ACCM 2008. 2008. pp. 192-196 (Progress of Composites 2008 in Asia and Australasia - Proceedings of the 6th Asian-Australasian Conference on Composite Materials, ACCM 2008).

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title = "Process analysis of adhesive bonding for composite Pi-joints",

abstract = "In the present paper, the flow of adhesives in composite Pi-joints is investigated numerically and experimentally. A model is developed to simulate the flow process using a computational fluid dynamics code. The results from this model are validated against matching experimental work. The viscosities of a number of adhesives were measured and found to be Non-Newtonian in character. A Non-Newtonian power law approach was found to represent the adhesives' viscosities very well. Based on the rheological data a material model was developed and implemented in the numerical code. The numerical predictions and the experimental results were found to be in good agreement. The model developed can be used to investigate the effect of various process parameters, such as insertion speed, insertion force and adhesive viscosity on output variables, including insertion force and the pressure distribution in the Pi-slot. The numerical model enables relatively simple investigations of process parameters, thus providing an efficient and useful tool to guide the bonding process design and control.",

keywords = "Adhesive bonding, Composite joint, Non-Newtonian viscosities, Power law model, Process simulation",

author = "Patryk Burka and Xiaolin Liu and John Sheridan and Mark Thompson",

year = "2008",

month = dec,

day = "1",

language = "English",

isbn = "9784901381321",

series = "Progress of Composites 2008 in Asia and Australasia - Proceedings of the 6th Asian-Australasian Conference on Composite Materials, ACCM 2008",

pages = "192--196",

booktitle = "Progress of Composites 2008 in Asia and Australasia - Proceedings of the 6th Asian-Australasian Conference on Composite Materials, ACCM 2008",

note = "Asian-Australian Conference on Composite Materials 2008, ACCM 2008 ; Conference date: 23-09-2008 Through 26-09-2008",

}

Burka, P, Liu, X, Sheridan, J & Thompson, M 2008, Process analysis of adhesive bonding for composite Pi-joints. in Progress of Composites 2008 in Asia and Australasia - Proceedings of the 6th Asian-Australasian Conference on Composite Materials, ACCM 2008. Progress of Composites 2008 in Asia and Australasia - Proceedings of the 6th Asian-Australasian Conference on Composite Materials, ACCM 2008, pp. 192-196, Asian-Australian Conference on Composite Materials 2008, Kumamoto, Kyushu, Japan, 23/09/08.

Process analysis of adhesive bonding for composite Pi-joints. / Burka, Patryk; Liu, Xiaolin; Sheridan, John et al.
Progress of Composites 2008 in Asia and Australasia - Proceedings of the 6th Asian-Australasian Conference on Composite Materials, ACCM 2008. 2008. p. 192-196 (Progress of Composites 2008 in Asia and Australasia - Proceedings of the 6th Asian-Australasian Conference on Composite Materials, ACCM 2008).

Research output: Chapter in Book/Report/Conference proceeding › Conference Paper › Other

TY - GEN

T1 - Process analysis of adhesive bonding for composite Pi-joints

AU - Burka, Patryk

AU - Liu, Xiaolin

AU - Sheridan, John

AU - Thompson, Mark

N1 - Conference code: 6th

PY - 2008/12/1

Y1 - 2008/12/1

N2 - In the present paper, the flow of adhesives in composite Pi-joints is investigated numerically and experimentally. A model is developed to simulate the flow process using a computational fluid dynamics code. The results from this model are validated against matching experimental work. The viscosities of a number of adhesives were measured and found to be Non-Newtonian in character. A Non-Newtonian power law approach was found to represent the adhesives' viscosities very well. Based on the rheological data a material model was developed and implemented in the numerical code. The numerical predictions and the experimental results were found to be in good agreement. The model developed can be used to investigate the effect of various process parameters, such as insertion speed, insertion force and adhesive viscosity on output variables, including insertion force and the pressure distribution in the Pi-slot. The numerical model enables relatively simple investigations of process parameters, thus providing an efficient and useful tool to guide the bonding process design and control.

AB - In the present paper, the flow of adhesives in composite Pi-joints is investigated numerically and experimentally. A model is developed to simulate the flow process using a computational fluid dynamics code. The results from this model are validated against matching experimental work. The viscosities of a number of adhesives were measured and found to be Non-Newtonian in character. A Non-Newtonian power law approach was found to represent the adhesives' viscosities very well. Based on the rheological data a material model was developed and implemented in the numerical code. The numerical predictions and the experimental results were found to be in good agreement. The model developed can be used to investigate the effect of various process parameters, such as insertion speed, insertion force and adhesive viscosity on output variables, including insertion force and the pressure distribution in the Pi-slot. The numerical model enables relatively simple investigations of process parameters, thus providing an efficient and useful tool to guide the bonding process design and control.

KW - Adhesive bonding

KW - Composite joint

KW - Non-Newtonian viscosities

KW - Power law model

KW - Process simulation

UR - https://www.scopus.com/pages/publications/84887561893

M3 - Conference Paper

AN - SCOPUS:84887561893

SN - 9784901381321

T3 - Progress of Composites 2008 in Asia and Australasia - Proceedings of the 6th Asian-Australasian Conference on Composite Materials, ACCM 2008

SP - 192

EP - 196

BT - Progress of Composites 2008 in Asia and Australasia - Proceedings of the 6th Asian-Australasian Conference on Composite Materials, ACCM 2008

T2 - Asian-Australian Conference on Composite Materials 2008

Y2 - 23 September 2008 through 26 September 2008

ER -

Burka P, Liu X, Sheridan J, Thompson M. Process analysis of adhesive bonding for composite Pi-joints. In Progress of Composites 2008 in Asia and Australasia - Proceedings of the 6th Asian-Australasian Conference on Composite Materials, ACCM 2008. 2008. p. 192-196. (Progress of Composites 2008 in Asia and Australasia - Proceedings of the 6th Asian-Australasian Conference on Composite Materials, ACCM 2008).

Process analysis of adhesive bonding for composite Pi-joints

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