Process analysis of adhesive bonding for composite Pi-joints

Patryk Burka, Xiaolin Liu, John Sheridan, Mark Thompson

Research output: Chapter in Book/Report/Conference proceedingConference PaperOther

1 Citation (Scopus)

Abstract

In the present paper, the flow of adhesives in composite Pi-joints is investigated numerically and experimentally. A model is developed to simulate the flow process using a computational fluid dynamics code. The results from this model are validated against matching experimental work. The viscosities of a number of adhesives were measured and found to be Non-Newtonian in character. A Non-Newtonian power law approach was found to represent the adhesives' viscosities very well. Based on the rheological data a material model was developed and implemented in the numerical code. The numerical predictions and the experimental results were found to be in good agreement. The model developed can be used to investigate the effect of various process parameters, such as insertion speed, insertion force and adhesive viscosity on output variables, including insertion force and the pressure distribution in the Pi-slot. The numerical model enables relatively simple investigations of process parameters, thus providing an efficient and useful tool to guide the bonding process design and control.

Original languageEnglish
Title of host publicationProgress of Composites 2008 in Asia and Australasia - Proceedings of the 6th Asian-Australasian Conference on Composite Materials, ACCM 2008
Pages192-196
Number of pages5
Publication statusPublished - 1 Dec 2008
Event6th Asian-Australasian Conference on Composite Materials: Progress of Composites 2008 in Asia and Australasia, ACCM 2008 - Kumamoto, Kyushu, Japan
Duration: 23 Sep 200826 Sep 2008

Publication series

NameProgress of Composites 2008 in Asia and Australasia - Proceedings of the 6th Asian-Australasian Conference on Composite Materials, ACCM 2008

Conference

Conference6th Asian-Australasian Conference on Composite Materials: Progress of Composites 2008 in Asia and Australasia, ACCM 2008
CountryJapan
CityKumamoto, Kyushu
Period23/09/0826/09/08

Keywords

  • Adhesive bonding
  • Composite joint
  • Non-Newtonian viscosities
  • Power law model
  • Process simulation

Cite this