Predictive die-level reliability-yield modeling for deep sub-micron devices

Melanie Ooi; Ye Chow Kuang; Chris Chan; Serge Demidenko

Predictive die-level reliability-yield modeling for deep sub-micron devices

Melanie Ooi, Ye Chow Kuang, Chris Chan, Serge Demidenko

Research output: Chapter in Book/Report/Conference proceeding › Conference Paper › Research › peer-review

Original language	English
Title of host publication	Proceedings Fourth IEEE International Symposium on Electronic Design, Test and Applications DELTA 2008
Editors	Adam Osseiran, Michel Renovell, Abbes Amira, Kong Pang Pun, Lai Kan Lincoln Leung
Place of Publication	New Jersey, US
Publisher	IEEE, Institute of Electrical and Electronics Engineers
Pages	216 - 221
Number of pages	6
Volume	0
ISBN (Print)	9780769531106
Publication status	Published - 2008
Event	IEEE International Symposium on Electronic Design, Test and Applications (DELTA) 2008 - Hong Kong, China Duration: 23 Jan 2008 → 25 Jan 2008 Conference number: 4th https://ieeexplore.ieee.org/xpl/conhome/4459488/proceeding (Proceedings)

Conference

Conference	IEEE International Symposium on Electronic Design, Test and Applications (DELTA) 2008
Abbreviated title	DELTA 2008
Country/Territory	China
City	Hong Kong
Period	23/01/08 → 25/01/08
Internet address	https://ieeexplore.ieee.org/xpl/conhome/4459488/proceeding (Proceedings)

Cite this

Ooi, M., Kuang, Y. C., Chan, C., & Demidenko, S. (2008). Predictive die-level reliability-yield modeling for deep sub-micron devices. In A. Osseiran, M. Renovell, A. Amira, K. P. Pun, & L. K. L. Leung (Eds.), Proceedings Fourth IEEE International Symposium on Electronic Design, Test and Applications DELTA 2008 (Vol. 0, pp. 216 - 221). IEEE, Institute of Electrical and Electronics Engineers.

Ooi, Melanie ; Kuang, Ye Chow ; Chan, Chris ; Demidenko, Serge. / Predictive die-level reliability-yield modeling for deep sub-micron devices. Proceedings Fourth IEEE International Symposium on Electronic Design, Test and Applications DELTA 2008. editor / Adam Osseiran ; Michel Renovell ; Abbes Amira ; Kong Pang Pun ; Lai Kan Lincoln Leung. Vol. 0 New Jersey, US : IEEE, Institute of Electrical and Electronics Engineers, 2008. pp. 216 - 221

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booktitle = "Proceedings Fourth IEEE International Symposium on Electronic Design, Test and Applications DELTA 2008",

publisher = "IEEE, Institute of Electrical and Electronics Engineers",

address = "United States of America",

note = "IEEE International Symposium on Electronic Design, Test and Applications (DELTA) 2008, DELTA 2008 ; Conference date: 23-01-2008 Through 25-01-2008",

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Ooi, M, Kuang, YC, Chan, C & Demidenko, S 2008, Predictive die-level reliability-yield modeling for deep sub-micron devices. in A Osseiran, M Renovell, A Amira, KP Pun & LKL Leung (eds), Proceedings Fourth IEEE International Symposium on Electronic Design, Test and Applications DELTA 2008. vol. 0, IEEE, Institute of Electrical and Electronics Engineers, New Jersey, US, pp. 216 - 221, IEEE International Symposium on Electronic Design, Test and Applications (DELTA) 2008, Hong Kong, China, 23/01/08.

Predictive die-level reliability-yield modeling for deep sub-micron devices. / Ooi, Melanie; Kuang, Ye Chow; Chan, Chris; Demidenko, Serge.

Proceedings Fourth IEEE International Symposium on Electronic Design, Test and Applications DELTA 2008. ed. / Adam Osseiran; Michel Renovell; Abbes Amira; Kong Pang Pun; Lai Kan Lincoln Leung. Vol. 0 New Jersey, US : IEEE, Institute of Electrical and Electronics Engineers, 2008. p. 216 - 221.

Research output: Chapter in Book/Report/Conference proceeding › Conference Paper › Research › peer-review

TY - GEN

T1 - Predictive die-level reliability-yield modeling for deep sub-micron devices

AU - Ooi, Melanie

AU - Kuang, Ye Chow

AU - Chan, Chris

AU - Demidenko, Serge

N1 - Conference code: 4th

PY - 2008

Y1 - 2008

M3 - Conference Paper

SN - 9780769531106

VL - 0

SP - 216

EP - 221

BT - Proceedings Fourth IEEE International Symposium on Electronic Design, Test and Applications DELTA 2008

A2 - Osseiran, Adam

A2 - Renovell, Michel

A2 - Amira, Abbes

A2 - Pun, Kong Pang

A2 - Leung, Lai Kan Lincoln

PB - IEEE, Institute of Electrical and Electronics Engineers

CY - New Jersey, US

T2 - IEEE International Symposium on Electronic Design, Test and Applications (DELTA) 2008

Y2 - 23 January 2008 through 25 January 2008

ER -

Ooi M, Kuang YC, Chan C, Demidenko S. Predictive die-level reliability-yield modeling for deep sub-micron devices. In Osseiran A, Renovell M, Amira A, Pun KP, Leung LKL, editors, Proceedings Fourth IEEE International Symposium on Electronic Design, Test and Applications DELTA 2008. Vol. 0. New Jersey, US: IEEE, Institute of Electrical and Electronics Engineers. 2008. p. 216 - 221