Predictive die-level reliability-yield modeling for deep sub-micron devices

Melanie Ooi; Ye Chow Kuang; Chris Chan; Serge Demidenko

Predictive die-level reliability-yield modeling for deep sub-micron devices

Melanie Ooi, Ye Chow Kuang, Chris Chan, Serge Demidenko

Electrical and Computer Systems Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference Paper › Research › peer-review

Original language	English
Title of host publication	Proceedings Fourth IEEE International Symposium on Electronic Design, Test and Applications DELTA 2008
Editors	Adam Osseiran, Michel Renovell, Abbes Amira, Kong Pang Pun, Lai Kan Lincoln Leung
Place of Publication	New Jersey, US
Publisher	IEEE, Institute of Electrical and Electronics Engineers
Pages	216 - 221
Number of pages	6
Volume	0
ISBN (Print)	9780769531106
Publication status	Published - 2008
Event	IEEE International Symposium on Electronic Design, Test and Applications (DELTA) 2008 - Hong Kong, China, New Jersey, US Duration: 1 Jan 2008 → …

Conference

Conference	IEEE International Symposium on Electronic Design, Test and Applications (DELTA) 2008
City	New Jersey, US
Period	1/01/08 → …

Cite this

Ooi, M., Kuang, Y. C., Chan, C., & Demidenko, S. (2008). Predictive die-level reliability-yield modeling for deep sub-micron devices. In A. Osseiran, M. Renovell, A. Amira, K. P. Pun, & L. K. L. Leung (Eds.), Proceedings Fourth IEEE International Symposium on Electronic Design, Test and Applications DELTA 2008 (Vol. 0, pp. 216 - 221). IEEE, Institute of Electrical and Electronics Engineers.

Ooi, Melanie ; Kuang, Ye Chow ; Chan, Chris ; Demidenko, Serge. / Predictive die-level reliability-yield modeling for deep sub-micron devices. Proceedings Fourth IEEE International Symposium on Electronic Design, Test and Applications DELTA 2008. editor / Adam Osseiran ; Michel Renovell ; Abbes Amira ; Kong Pang Pun ; Lai Kan Lincoln Leung. Vol. 0 New Jersey, US : IEEE, Institute of Electrical and Electronics Engineers, 2008. pp. 216 - 221

@inproceedings{a24d21cf95654655be1ea53f5d953554,

title = "Predictive die-level reliability-yield modeling for deep sub-micron devices",

author = "Melanie Ooi and Kuang, {Ye Chow} and Chris Chan and Serge Demidenko",

year = "2008",

language = "English",

isbn = "9780769531106",

volume = "0",

pages = "216 -- 221",

editor = "Adam Osseiran and Michel Renovell and Abbes Amira and Pun, {Kong Pang} and Leung, {Lai Kan Lincoln}",

booktitle = "Proceedings Fourth IEEE International Symposium on Electronic Design, Test and Applications DELTA 2008",

publisher = "IEEE, Institute of Electrical and Electronics Engineers",

address = "United States of America",

note = "IEEE International Symposium on Electronic Design, Test and Applications (DELTA) 2008 ; Conference date: 01-01-2008",

}

Ooi, M, Kuang, YC, Chan, C & Demidenko, S 2008, Predictive die-level reliability-yield modeling for deep sub-micron devices. in A Osseiran, M Renovell, A Amira, KP Pun & LKL Leung (eds), Proceedings Fourth IEEE International Symposium on Electronic Design, Test and Applications DELTA 2008. vol. 0, IEEE, Institute of Electrical and Electronics Engineers, New Jersey, US, pp. 216 - 221, IEEE International Symposium on Electronic Design, Test and Applications (DELTA) 2008, New Jersey, US, 1/01/08.

Predictive die-level reliability-yield modeling for deep sub-micron devices. / Ooi, Melanie; Kuang, Ye Chow; Chan, Chris; Demidenko, Serge.

Proceedings Fourth IEEE International Symposium on Electronic Design, Test and Applications DELTA 2008. ed. / Adam Osseiran; Michel Renovell; Abbes Amira; Kong Pang Pun; Lai Kan Lincoln Leung. Vol. 0 New Jersey, US : IEEE, Institute of Electrical and Electronics Engineers, 2008. p. 216 - 221.

Research output: Chapter in Book/Report/Conference proceeding › Conference Paper › Research › peer-review

TY - GEN

T1 - Predictive die-level reliability-yield modeling for deep sub-micron devices

AU - Ooi, Melanie

AU - Kuang, Ye Chow

AU - Chan, Chris

AU - Demidenko, Serge

PY - 2008

Y1 - 2008

M3 - Conference Paper

SN - 9780769531106

VL - 0

SP - 216

EP - 221

BT - Proceedings Fourth IEEE International Symposium on Electronic Design, Test and Applications DELTA 2008

A2 - Osseiran, Adam

A2 - Renovell, Michel

A2 - Amira, Abbes

A2 - Pun, Kong Pang

A2 - Leung, Lai Kan Lincoln

PB - IEEE, Institute of Electrical and Electronics Engineers

CY - New Jersey, US

T2 - IEEE International Symposium on Electronic Design, Test and Applications (DELTA) 2008

Y2 - 1 January 2008

ER -

Ooi M, Kuang YC, Chan C, Demidenko S. Predictive die-level reliability-yield modeling for deep sub-micron devices. In Osseiran A, Renovell M, Amira A, Pun KP, Leung LKL, editors, Proceedings Fourth IEEE International Symposium on Electronic Design, Test and Applications DELTA 2008. Vol. 0. New Jersey, US: IEEE, Institute of Electrical and Electronics Engineers. 2008. p. 216 - 221