Packing of fine powders subjected to tapping

A. B. Yu; J. S. Hall

doi:10.1016/0032-5910(93)02790-H

Packing of fine powders subjected to tapping

A. B. Yu
, J. S. Hall

Research output: Contribution to journal › Article › Research › peer-review

55 Citations (Scopus)

Abstract

An investigation has been carried out of the packing densities of alumina and silicon carbide powders to determine the effect of material properties, particle shape and size distribution when subjected to tapping. The variations of packing density with tapping number for various powders are experimentally measured. It is shown that the measured relationship between packing density and tapping number can satisfactorily be described by either the modified Heckel or Kawakita equation. An attempt is then made to correlate the parameters in the two equations with the Hausner ratio. The results suggest that the packing of fine powders subjected to tapping can be characterised by this ratio.

Original language	English
Pages (from-to)	247-256
Number of pages	10
Journal	Powder Technology
Volume	78
Issue number	3
DOIs	https://doi.org/10.1016/0032-5910(93)02790-H
Publication status	Published - 1 Jan 1994
Externally published	Yes

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abstract = "An investigation has been carried out of the packing densities of alumina and silicon carbide powders to determine the effect of material properties, particle shape and size distribution when subjected to tapping. The variations of packing density with tapping number for various powders are experimentally measured. It is shown that the measured relationship between packing density and tapping number can satisfactorily be described by either the modified Heckel or Kawakita equation. An attempt is then made to correlate the parameters in the two equations with the Hausner ratio. The results suggest that the packing of fine powders subjected to tapping can be characterised by this ratio.",

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N2 - An investigation has been carried out of the packing densities of alumina and silicon carbide powders to determine the effect of material properties, particle shape and size distribution when subjected to tapping. The variations of packing density with tapping number for various powders are experimentally measured. It is shown that the measured relationship between packing density and tapping number can satisfactorily be described by either the modified Heckel or Kawakita equation. An attempt is then made to correlate the parameters in the two equations with the Hausner ratio. The results suggest that the packing of fine powders subjected to tapping can be characterised by this ratio.

AB - An investigation has been carried out of the packing densities of alumina and silicon carbide powders to determine the effect of material properties, particle shape and size distribution when subjected to tapping. The variations of packing density with tapping number for various powders are experimentally measured. It is shown that the measured relationship between packing density and tapping number can satisfactorily be described by either the modified Heckel or Kawakita equation. An attempt is then made to correlate the parameters in the two equations with the Hausner ratio. The results suggest that the packing of fine powders subjected to tapping can be characterised by this ratio.

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JO - Powder Technology

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Packing of fine powders subjected to tapping

Abstract

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