On-OPCB interconnection networks

Apostolos Siokis, Konstantinos Christodoulopoulos, Emmanouel Varvarigos

Research output: Chapter in Book/Report/Conference proceedingConference PaperResearchpeer-review


Photonic solutions are penetrating the lowest levels of the packaging hierarchy of Data Centers (DC) and HighPerformance Computing (HPC) systems (board-to-board, chip-to-chip, intra-chip), as a solution for the increased bandwidth demands and to avoid an explosion in energy consumption. To fully exploit their offered benefits, HPC and DCs architectures need to be reconsidered. In this paper we focus on the on-OPCB (optical printed circuit board) packaging level and describe a lay-out strategy for direct interconnection networks. We also outline a methodology for on-OPCB interconnection network design that takes as input a set of packaging and required performance parameters and incorporates our proposed lay-out strategy. We apply our OPCB designing methodology, using realistic parameters, to highlight potential bottlenecks and to explore the benefits of photonic technological advancements (namely, smaller bending radiuses, crossing angles and chip footprints).

Original languageEnglish
Title of host publication2014 16th International Conference on Transparent Optical Networks
EditorsMarek Jaworski, Marian Marciniak
Place of PublicationPiscataway NJ USA
PublisherIEEE, Institute of Electrical and Electronics Engineers
Number of pages4
ISBN (Electronic)9781479956029
ISBN (Print)9781479956005
Publication statusPublished - 2014
Externally publishedYes
EventInternational Conference on Transparent Optical Networks 2014 - Convention Center Graz (Grazer Messe), Graz, Austria
Duration: 6 Jul 201410 Jul 2014
Conference number: 16th


ConferenceInternational Conference on Transparent Optical Networks 2014
Abbreviated titleICTON 2014
Internet address


  • Direct networks
  • Interconnection networks design methodology
  • Optical interconnects
  • Optical printed circuit board (OPCB)
  • Topology layout

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