Monitoring cuprous ion transport by scanning electrochemical microscopy during the course of copper electrodeposition

Anthony Peter O'Mullane, Aaron K Neufeld, Alan Maxwell Bond

Research output: Contribution to journal › Article › Research › peer-review

Original language	English
Pages (from-to)	538 - 541
Number of pages	4
Journal	Journal of the Electrochemical Society
Volume	155
Issue number	8
Publication status	Published - 2008

Cite this

@article{a4939acbbe5b498596a28a1089715f0c,

title = "Monitoring cuprous ion transport by scanning electrochemical microscopy during the course of copper electrodeposition",

author = "O'Mullane, {Anthony Peter} and Neufeld, {Aaron K} and Bond, {Alan Maxwell}",

year = "2008",

language = "English",

volume = "155",

pages = "538 -- 541",

journal = "Journal of the Electrochemical Society",

issn = "0013-4651",

publisher = "Electrochemical Society Inc.",

number = "8",

}

TY - JOUR

T1 - Monitoring cuprous ion transport by scanning electrochemical microscopy during the course of copper electrodeposition

AU - O'Mullane, Anthony Peter

AU - Neufeld, Aaron K

AU - Bond, Alan Maxwell

PY - 2008

Y1 - 2008

M3 - Article

VL - 155

SP - 538

EP - 541

JO - Journal of the Electrochemical Society

JF - Journal of the Electrochemical Society

SN - 0013-4651

IS - 8

ER -