Modelling discontinuous dynamic recrystallization using a physically-based model for nucleation

Darren G. Cram, Hatem S Zurob, Yves J M Brechet, Christopher R. Hutchinson

Research output: Chapter in Book/Report/Conference proceedingConference PaperOther

1 Citation (Scopus)

Abstract

A physically-based model for nucleation during discontinuous dynamic recrystallization (DDRX) has been developed and is coupled with polyphase plasticity and grain growth models to predict the macroscopic stress and grain size evolution during straining. The nucleation model is based on a recent description for static recrystallization and considers the dynamically evolving substructure size. Model predictions are compared with literature results on DDRX in pure Cu as a function of initial grain size, deformation temperature and strain-rate. The characteristic DRX features such as single to multiple peak stress transitions and convergence towards a steady-state stress and grain size are quantitatively reproduced by the model.

Original languageEnglish
Title of host publicationRecrystallization and Grain Growth IV
EditorsE.J. Palmiere, B.P. Wynne
Pages492-497
Number of pages6
DOIs
Publication statusPublished - 2012
Event4th International Conference on Recrystallization and Grain Growth, ReX and GG IV - Sheffield, United Kingdom
Duration: 4 Jul 20109 Jul 2010

Publication series

NameMaterials Science Forum
PublisherTrans Tech Publications Ltd.
Volume715-716
ISSN (Print)0255-5476
ISSN (Electronic)1662-9752

Conference

Conference4th International Conference on Recrystallization and Grain Growth, ReX and GG IV
CountryUnited Kingdom
CitySheffield
Period4/07/109/07/10

Keywords

  • Copper
  • Dynamic recrystallization
  • Nucleation
  • Subgrain growth

Cite this

Cram, D. G., Zurob, H. S., Brechet, Y. J. M., & Hutchinson, C. R. (2012). Modelling discontinuous dynamic recrystallization using a physically-based model for nucleation. In E. J. Palmiere, & B. P. Wynne (Eds.), Recrystallization and Grain Growth IV (pp. 492-497). (Materials Science Forum; Vol. 715-716). https://doi.org/10.4028/www.scientific.net/MSF.715-716.492