Modelling and simulation of electrostatic adhesion for robotic devices

Keng Huat Koh, Kuppan Chetty Ramanathan, SG Ponnambalam

    Research output: Chapter in Book/Report/Conference proceedingConference PaperResearchpeer-review

    Original languageEnglish
    Title of host publicationProceedings of the 2012 International Conference on Electronics, Information and Communication Engineering (EICE)
    EditorsGarry Lee
    Place of PublicationUSA
    PublisherInformation Engineering Research Institute
    Pages208 - 216
    Number of pages9
    ISBN (Print)9781612750071
    Publication statusPublished - 2012
    EventInternational Conference on Electronics, Information and Communication Engineering (EICE) - Macau, USA
    Duration: 1 Jan 2012 → …

    Conference

    ConferenceInternational Conference on Electronics, Information and Communication Engineering (EICE)
    CityUSA
    Period1/01/12 → …

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