Modelling and simulation of electrostatic adhesion for robotic devices

Keng Huat Koh; Kuppan Chetty Ramanathan; SG Ponnambalam

Modelling and simulation of electrostatic adhesion for robotic devices

Keng Huat Koh, Kuppan Chetty Ramanathan, SG Ponnambalam

Malaysia Sch of Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference Paper › Research › peer-review

Original language	English
Title of host publication	Proceedings of the 2012 International Conference on Electronics, Information and Communication Engineering (EICE)
Editors	Garry Lee
Place of Publication	USA
Publisher	Information Engineering Research Institute
Pages	208 - 216
Number of pages	9
ISBN (Print)	9781612750071
Publication status	Published - 2012
Event	International Conference on Electronics, Information and Communication Engineering (EICE) - Macau, USA Duration: 1 Jan 2012 → …

Conference

Conference	International Conference on Electronics, Information and Communication Engineering (EICE)
City	USA
Period	1/01/12 → …

Cite this

@inproceedings{37e71809a4784104a71ac701d52d364d,

title = "Modelling and simulation of electrostatic adhesion for robotic devices",

author = "Koh, {Keng Huat} and Ramanathan, {Kuppan Chetty} and SG Ponnambalam",

year = "2012",

language = "English",

isbn = "9781612750071",

pages = "208 -- 216",

editor = "Garry Lee",

booktitle = "Proceedings of the 2012 International Conference on Electronics, Information and Communication Engineering (EICE)",

publisher = "Information Engineering Research Institute",

note = "International Conference on Electronics, Information and Communication Engineering (EICE) ; Conference date: 01-01-2012",

}

Koh, KH, Ramanathan, KC & Ponnambalam, SG 2012, Modelling and simulation of electrostatic adhesion for robotic devices. in G Lee (ed.), Proceedings of the 2012 International Conference on Electronics, Information and Communication Engineering (EICE). Information Engineering Research Institute, USA, pp. 208 - 216, International Conference on Electronics, Information and Communication Engineering (EICE), USA, 1/01/12.

Modelling and simulation of electrostatic adhesion for robotic devices. / Koh, Keng Huat; Ramanathan, Kuppan Chetty; Ponnambalam, SG.
Proceedings of the 2012 International Conference on Electronics, Information and Communication Engineering (EICE). ed. / Garry Lee. USA: Information Engineering Research Institute, 2012. p. 208 - 216.

Research output: Chapter in Book/Report/Conference proceeding › Conference Paper › Research › peer-review

TY - GEN

T1 - Modelling and simulation of electrostatic adhesion for robotic devices

AU - Koh, Keng Huat

AU - Ramanathan, Kuppan Chetty

AU - Ponnambalam, SG

PY - 2012

Y1 - 2012

UR - http://www.ier-institute.org/2070-1918/lnit11/v11/208.pdf

M3 - Conference Paper

SN - 9781612750071

SP - 208

EP - 216

BT - Proceedings of the 2012 International Conference on Electronics, Information and Communication Engineering (EICE)

A2 - Lee, Garry

PB - Information Engineering Research Institute

CY - USA

T2 - International Conference on Electronics, Information and Communication Engineering (EICE)

Y2 - 1 January 2012

ER -

Modelling and simulation of electrostatic adhesion for robotic devices

Conference

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Cite this