Modeling and simulation of electrostatic adhesion for wall climbing robot

Keng Huat Koh, Kuppan Chetty Ramanathan, SG Ponnambalam

    Research output: Chapter in Book/Report/Conference proceedingConference PaperResearchpeer-review

    24 Citations (Scopus)
    Original languageEnglish
    Title of host publicationProceedings of the 2011 IEEE International Conference on Robotics and Biomimetics
    EditorsAiguo Ming
    Place of PublicationUSA
    PublisherIEEE, Institute of Electrical and Electronics Engineers
    Pages2031 - 2036
    Number of pages6
    ISBN (Print)9781457721373
    DOIs
    Publication statusPublished - 2011
    EventIEEE International Conference on Robotics and Biomimetics 2011 - Phuket Thailand, Phuket, Thailand
    Duration: 7 Dec 201111 Dec 2011

    Conference

    ConferenceIEEE International Conference on Robotics and Biomimetics 2011
    Abbreviated titleROBIO 2011
    CountryThailand
    CityPhuket
    Period7/12/1111/12/11

    Cite this

    Koh, K. H., Ramanathan, K. C., & Ponnambalam, SG. (2011). Modeling and simulation of electrostatic adhesion for wall climbing robot. In A. Ming (Ed.), Proceedings of the 2011 IEEE International Conference on Robotics and Biomimetics (pp. 2031 - 2036). USA: IEEE, Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/ROBIO.2011.6181590
    Koh, Keng Huat ; Ramanathan, Kuppan Chetty ; Ponnambalam, SG. / Modeling and simulation of electrostatic adhesion for wall climbing robot. Proceedings of the 2011 IEEE International Conference on Robotics and Biomimetics. editor / Aiguo Ming. USA : IEEE, Institute of Electrical and Electronics Engineers, 2011. pp. 2031 - 2036
    @inproceedings{f746907b0b654d259f9958d486fddd2f,
    title = "Modeling and simulation of electrostatic adhesion for wall climbing robot",
    author = "Koh, {Keng Huat} and Ramanathan, {Kuppan Chetty} and SG Ponnambalam",
    year = "2011",
    doi = "10.1109/ROBIO.2011.6181590",
    language = "English",
    isbn = "9781457721373",
    pages = "2031 -- 2036",
    editor = "Aiguo Ming",
    booktitle = "Proceedings of the 2011 IEEE International Conference on Robotics and Biomimetics",
    publisher = "IEEE, Institute of Electrical and Electronics Engineers",
    address = "United States of America",

    }

    Koh, KH, Ramanathan, KC & Ponnambalam, SG 2011, Modeling and simulation of electrostatic adhesion for wall climbing robot. in A Ming (ed.), Proceedings of the 2011 IEEE International Conference on Robotics and Biomimetics. IEEE, Institute of Electrical and Electronics Engineers, USA, pp. 2031 - 2036, IEEE International Conference on Robotics and Biomimetics 2011, Phuket, Thailand, 7/12/11. https://doi.org/10.1109/ROBIO.2011.6181590

    Modeling and simulation of electrostatic adhesion for wall climbing robot. / Koh, Keng Huat; Ramanathan, Kuppan Chetty; Ponnambalam, SG.

    Proceedings of the 2011 IEEE International Conference on Robotics and Biomimetics. ed. / Aiguo Ming. USA : IEEE, Institute of Electrical and Electronics Engineers, 2011. p. 2031 - 2036.

    Research output: Chapter in Book/Report/Conference proceedingConference PaperResearchpeer-review

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    AU - Ramanathan, Kuppan Chetty

    AU - Ponnambalam, SG

    PY - 2011

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    DO - 10.1109/ROBIO.2011.6181590

    M3 - Conference Paper

    SN - 9781457721373

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    EP - 2036

    BT - Proceedings of the 2011 IEEE International Conference on Robotics and Biomimetics

    A2 - Ming, Aiguo

    PB - IEEE, Institute of Electrical and Electronics Engineers

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    ER -

    Koh KH, Ramanathan KC, Ponnambalam SG. Modeling and simulation of electrostatic adhesion for wall climbing robot. In Ming A, editor, Proceedings of the 2011 IEEE International Conference on Robotics and Biomimetics. USA: IEEE, Institute of Electrical and Electronics Engineers. 2011. p. 2031 - 2036 https://doi.org/10.1109/ROBIO.2011.6181590