Modeling and simulation of electrostatic adhesion for wall climbing robot

Keng Huat Koh; Kuppan Chetty Ramanathan; SG Ponnambalam

doi:10.1109/ROBIO.2011.6181590

Modeling and simulation of electrostatic adhesion for wall climbing robot

Keng Huat Koh, Kuppan Chetty Ramanathan, SG Ponnambalam

Malaysia Sch of Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference Paper › Research › peer-review

39 Citations (Scopus)

Original language	English
Title of host publication	Proceedings of the 2011 IEEE International Conference on Robotics and Biomimetics
Editors	Aiguo Ming
Place of Publication	USA
Publisher	IEEE, Institute of Electrical and Electronics Engineers
Pages	2031 - 2036
Number of pages	6
ISBN (Print)	9781457721373
DOIs	https://doi.org/10.1109/ROBIO.2011.6181590
Publication status	Published - 2011
Event	IEEE International Conference on Robotics and Biomimetics 2011 - Phuket, Thailand Duration: 7 Dec 2011 → 11 Dec 2011 https://ieeexplore.ieee.org/xpl/conhome/6175417/proceeding (Proceedings)

Conference

Conference	IEEE International Conference on Robotics and Biomimetics 2011
Abbreviated title	ROBIO 2011
Country/Territory	Thailand
City	Phuket
Period	7/12/11 → 11/12/11
Internet address	https://ieeexplore.ieee.org/xpl/conhome/6175417/proceeding (Proceedings)

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10.1109/ROBIO.2011.6181590

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@inproceedings{f746907b0b654d259f9958d486fddd2f,

title = "Modeling and simulation of electrostatic adhesion for wall climbing robot",

author = "Koh, {Keng Huat} and Ramanathan, {Kuppan Chetty} and SG Ponnambalam",

year = "2011",

doi = "10.1109/ROBIO.2011.6181590",

language = "English",

isbn = "9781457721373",

pages = "2031 -- 2036",

editor = "Aiguo Ming",

booktitle = "Proceedings of the 2011 IEEE International Conference on Robotics and Biomimetics",

publisher = "IEEE, Institute of Electrical and Electronics Engineers",

address = "United States of America",

note = "IEEE International Conference on Robotics and Biomimetics 2011, ROBIO 2011 ; Conference date: 07-12-2011 Through 11-12-2011",

url = "https://ieeexplore.ieee.org/xpl/conhome/6175417/proceeding",

}

Koh, KH, Ramanathan, KC & Ponnambalam, SG 2011, Modeling and simulation of electrostatic adhesion for wall climbing robot. in A Ming (ed.), Proceedings of the 2011 IEEE International Conference on Robotics and Biomimetics. IEEE, Institute of Electrical and Electronics Engineers, USA, pp. 2031 - 2036, IEEE International Conference on Robotics and Biomimetics 2011, Phuket, Thailand, 7/12/11. https://doi.org/10.1109/ROBIO.2011.6181590

Modeling and simulation of electrostatic adhesion for wall climbing robot. / Koh, Keng Huat; Ramanathan, Kuppan Chetty; Ponnambalam, SG.

Proceedings of the 2011 IEEE International Conference on Robotics and Biomimetics. ed. / Aiguo Ming. USA : IEEE, Institute of Electrical and Electronics Engineers, 2011. p. 2031 - 2036.

Research output: Chapter in Book/Report/Conference proceeding › Conference Paper › Research › peer-review

TY - GEN

T1 - Modeling and simulation of electrostatic adhesion for wall climbing robot

AU - Koh, Keng Huat

AU - Ramanathan, Kuppan Chetty

AU - Ponnambalam, SG

PY - 2011

Y1 - 2011

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U2 - 10.1109/ROBIO.2011.6181590

DO - 10.1109/ROBIO.2011.6181590

M3 - Conference Paper

SN - 9781457721373

SP - 2031

EP - 2036

BT - Proceedings of the 2011 IEEE International Conference on Robotics and Biomimetics

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PB - IEEE, Institute of Electrical and Electronics Engineers

CY - USA

T2 - IEEE International Conference on Robotics and Biomimetics 2011

Y2 - 7 December 2011 through 11 December 2011

ER -

Modeling and simulation of electrostatic adhesion for wall climbing robot

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