Modeling and simulation of electrostatic adhesion for wall climbing robot

Keng Huat Koh, Kuppan Chetty Ramanathan, SG Ponnambalam

Research output: Chapter in Book/Report/Conference proceedingConference PaperResearchpeer-review

35 Citations (Scopus)
Original languageEnglish
Title of host publicationProceedings of the 2011 IEEE International Conference on Robotics and Biomimetics
EditorsAiguo Ming
Place of PublicationUSA
PublisherIEEE, Institute of Electrical and Electronics Engineers
Pages2031 - 2036
Number of pages6
ISBN (Print)9781457721373
DOIs
Publication statusPublished - 2011
EventIEEE International Conference on Robotics and Biomimetics 2011 - Phuket, Thailand
Duration: 7 Dec 201111 Dec 2011
https://ieeexplore.ieee.org/xpl/conhome/6175417/proceeding (Proceedings)

Conference

ConferenceIEEE International Conference on Robotics and Biomimetics 2011
Abbreviated titleROBIO 2011
Country/TerritoryThailand
CityPhuket
Period7/12/1111/12/11
Internet address

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