TY - JOUR
T1 - Manufacturing of high strength and high conductivity copper with laser powder bed fusion
AU - Liu, Yingang
AU - Zhang, Jingqi
AU - Niu, Ranming
AU - Bayat, Mohamad
AU - Zhou, Ying
AU - Yin, Yu
AU - Tan, Qiyang
AU - Liu, Shiyang
AU - Hattel, Jesper Henri
AU - Li, Miaoquan
AU - Huang, Xiaoxu
AU - Cairney, Julie
AU - Chen, Yi Sheng
AU - Easton, Mark
AU - Hutchinson, Christopher
AU - Zhang, Ming Xing
N1 - Funding Information:
This work was supported by the Australian Research Council (ARC, grant number: DP210103162). We thank Meng Li of The University of Queensland for undertaking the electrical conductivity test. M.B. acknowledge the funding from Independent Research Fund Denmark, DIGI-3D project (Contract number: 0136–00210B). The authors from Northwestern Polytechnical University thank the State Key Laboratory of Solidification Processing in NWPU for funding support (Grant number: SKLSP202319). The authors from The University of Queensland thank Australian Microscopy & Microanalysis Research Facility at the Centre for Microscopy and Microanalysis (CMM), The University of Queensland for the facilities and technical assistance. The authors are grateful for the scientific and technical support from the Australian Centre for Microscopy and Microanalysis (ACMM) as well as the Microscopy Australia Node at the University of Sydney.
Funding Information:
This work was supported by the Australian Research Council (ARC, grant number: DP210103162). We thank Meng Li of The University of Queensland for undertaking the electrical conductivity test. M.B. acknowledge the funding from Independent Research Fund Denmark, DIGI-3D project (Contract number: 0136–00210B). The authors from Northwestern Polytechnical University thank the State Key Laboratory of Solidification Processing in NWPU for funding support (Grant number: SKLSP202319). The authors from The University of Queensland thank Australian Microscopy & Microanalysis Research Facility at the Centre for Microscopy and Microanalysis (CMM), The University of Queensland for the facilities and technical assistance. The authors are grateful for the scientific and technical support from the Australian Centre for Microscopy and Microanalysis (ACMM) as well as the Microscopy Australia Node at the University of Sydney.
Publisher Copyright:
© The Author(s) 2024.
PY - 2024/2/12
Y1 - 2024/2/12
N2 - Additive manufacturing (AM), known as 3D printing, enables rapid fabrication of geometrically complex copper (Cu) components for electrical conduction and heat management applications. However, pure Cu or Cu alloys produced by 3D printing often suffer from either low strength or low conductivity at room and elevated temperatures. Here, we demonstrate a design strategy for 3D printing of high strength, high conductivity Cu by uniformly dispersing a minor portion of lanthanum hexaboride (LaB6) nanoparticles in pure Cu through laser powder bed fusion (L-PBF). We show that trace additions of LaB6 to pure Cu results in an improved L-PBF processability, an enhanced strength, an improved thermal stability, all whilst maintaining a high conductivity. The presented strategy could expand the applicability of 3D printed Cu components to more demanding conditions where high strength, high conductivity and thermal stability are required.
AB - Additive manufacturing (AM), known as 3D printing, enables rapid fabrication of geometrically complex copper (Cu) components for electrical conduction and heat management applications. However, pure Cu or Cu alloys produced by 3D printing often suffer from either low strength or low conductivity at room and elevated temperatures. Here, we demonstrate a design strategy for 3D printing of high strength, high conductivity Cu by uniformly dispersing a minor portion of lanthanum hexaboride (LaB6) nanoparticles in pure Cu through laser powder bed fusion (L-PBF). We show that trace additions of LaB6 to pure Cu results in an improved L-PBF processability, an enhanced strength, an improved thermal stability, all whilst maintaining a high conductivity. The presented strategy could expand the applicability of 3D printed Cu components to more demanding conditions where high strength, high conductivity and thermal stability are required.
UR - https://www.scopus.com/pages/publications/85185150014
U2 - 10.1038/s41467-024-45732-y
DO - 10.1038/s41467-024-45732-y
M3 - Article
C2 - 38347023
AN - SCOPUS:85185150014
SN - 2041-1723
VL - 15
JO - Nature Communications
JF - Nature Communications
IS - 1
M1 - 1283
ER -