Abstract
We present a new class of low-loss integrated optical waveguide structures as CMOS-compatible industrial standard for photonic integration on silicon or glass. A TriPleXTM waveguide is basically formed by a -preferably rectangular- silicon nitride (Si3N4) shell filled with and encapsulated by silicon dioxide (SiO2). The constituent materials are low-cost stoichiometric LPVCD end products which are very stable in time. Modal characteristics, birefringence, footprint size and insertion loss are controlled by design of the geometry. Several examples of new applications will be presented to demonstrate its high potential for large-scale integrated optical circuits for telecommunications, sensing and visible light applications.
| Original language | English |
|---|---|
| Title of host publication | Photonics Packaging, Integration, and Interconnects IX |
| Volume | 7221 |
| DOIs | |
| Publication status | Published - 2009 |
| Externally published | Yes |
| Event | Photonics Packaging, Integration, and Interconnects IX - San Jose, CA, United States of America Duration: 26 Jan 2009 → 28 Jan 2009 |
Conference
| Conference | Photonics Packaging, Integration, and Interconnects IX |
|---|---|
| Country/Territory | United States of America |
| City | San Jose, CA |
| Period | 26/01/09 → 28/01/09 |
Keywords
- Birefringence
- CMOS compatible
- integrated optics
- IR
- low loss
- Multilayer waveguides
- Optical waveguides
- PLCs
- UV
- Visible