Integrated photonic signal processors for microwave photonics and optical communications

A progress review in TriPleX™ Si3N4 waveguide technology

Leimeng Zhuang, Caterina Taddei, Marcel Hoekman, Ronald Dekker, Chris G. G. Roeloffzen, Klaus J Boller, Arthur J. Lowery

Research output: Chapter in Book/Report/Conference proceedingConference PaperResearchpeer-review

5 Citations (Scopus)

Abstract

We provide a brief review of recent progress in TriPleX™ Si3N4 waveguide technology for integrated photonic signal processors, with applications in microwave photonic and optical communication systems. We discuss the challenges, opportunities and future expectations for these signal processors.
Original languageEnglish
Title of host publicationAsia Communications and Photonics Conference (ACP 2014)
EditorsShaohua Yu
Place of PublicationWashington DC USA
PublisherOptical Society of America (OSA)
Pages1 - 3
Number of pages3
ISBN (Print)9781557528520
DOIs
Publication statusPublished - 14 Nov 2014
EventAsia Communications and Photonics Conference 2014 - Shanghai, China
Duration: 11 Nov 201414 Nov 2014

Conference

ConferenceAsia Communications and Photonics Conference 2014
Abbreviated titleACP 2014
CountryChina
CityShanghai
Period11/11/1414/11/14

Cite this

Zhuang, L., Taddei, C., Hoekman, M., Dekker, R., Roeloffzen, C. G. G., Boller, K. J., & Lowery, A. J. (2014). Integrated photonic signal processors for microwave photonics and optical communications: A progress review in TriPleX™ Si3N4 waveguide technology. In S. Yu (Ed.), Asia Communications and Photonics Conference (ACP 2014) (pp. 1 - 3). Washington DC USA: Optical Society of America (OSA). https://doi.org/10.1364/ACPC.2014.ATh1F.3
Zhuang, Leimeng ; Taddei, Caterina ; Hoekman, Marcel ; Dekker, Ronald ; Roeloffzen, Chris G. G. ; Boller, Klaus J ; Lowery, Arthur J. / Integrated photonic signal processors for microwave photonics and optical communications : A progress review in TriPleX™ Si3N4 waveguide technology. Asia Communications and Photonics Conference (ACP 2014). editor / Shaohua Yu. Washington DC USA : Optical Society of America (OSA), 2014. pp. 1 - 3
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abstract = "We provide a brief review of recent progress in TriPleX™ Si3N4 waveguide technology for integrated photonic signal processors, with applications in microwave photonic and optical communication systems. We discuss the challenges, opportunities and future expectations for these signal processors.",
author = "Leimeng Zhuang and Caterina Taddei and Marcel Hoekman and Ronald Dekker and Roeloffzen, {Chris G. G.} and Boller, {Klaus J} and Lowery, {Arthur J.}",
year = "2014",
month = "11",
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doi = "10.1364/ACPC.2014.ATh1F.3",
language = "English",
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Zhuang, L, Taddei, C, Hoekman, M, Dekker, R, Roeloffzen, CGG, Boller, KJ & Lowery, AJ 2014, Integrated photonic signal processors for microwave photonics and optical communications: A progress review in TriPleX™ Si3N4 waveguide technology. in S Yu (ed.), Asia Communications and Photonics Conference (ACP 2014). Optical Society of America (OSA), Washington DC USA, pp. 1 - 3, Asia Communications and Photonics Conference 2014, Shanghai, China, 11/11/14. https://doi.org/10.1364/ACPC.2014.ATh1F.3

Integrated photonic signal processors for microwave photonics and optical communications : A progress review in TriPleX™ Si3N4 waveguide technology. / Zhuang, Leimeng; Taddei, Caterina; Hoekman, Marcel; Dekker, Ronald; Roeloffzen, Chris G. G.; Boller, Klaus J; Lowery, Arthur J.

Asia Communications and Photonics Conference (ACP 2014). ed. / Shaohua Yu. Washington DC USA : Optical Society of America (OSA), 2014. p. 1 - 3.

Research output: Chapter in Book/Report/Conference proceedingConference PaperResearchpeer-review

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Zhuang L, Taddei C, Hoekman M, Dekker R, Roeloffzen CGG, Boller KJ et al. Integrated photonic signal processors for microwave photonics and optical communications: A progress review in TriPleX™ Si3N4 waveguide technology. In Yu S, editor, Asia Communications and Photonics Conference (ACP 2014). Washington DC USA: Optical Society of America (OSA). 2014. p. 1 - 3 https://doi.org/10.1364/ACPC.2014.ATh1F.3