High strength and electrical conductivity of UFG copper alloys

Y. Champion, J. P. Couzinié, S. Tusseau-Nenez, Y. Bréchet, R. K. Islamgaliev, R. Z. Valiev

Research output: Chapter in Book/Report/Conference proceedingConference PaperOther

3 Citations (Scopus)

Abstract

Copper based materials are still the most attractive low resistivity materials for microelectronics and electrotechnics applications, though, all variants developed to combine strength and conductivity, such as solid solutions and composites, suffer from decay in electric conductivity while strength is increased. In a addition, linear decay was also conjectured for pure copper when grain size is refined below the UFG and nanostructured domains (except when grain boundaries are pure twins). Copper alloys with low content of silver and chromium were prepared by high pressure torsion (HPT) with various annealing conditions. Vickers hardness and electric resistivity in the temperature range of 4K-340K, were measured as well as microstructural characterizations were performed using quantitative X-ray diffraction. Depending on the annealing conditions the alloys exhibit from 25% to 75% of IACS electric conductivity at room temperature and hardness in the range of 200 Hv. Origins of both high strength and high electric conductivity were investigated from microstructures analysis, using transmission electron microscopy and mechanical testing.

Original languageEnglish
Title of host publicationNanomaterials by Severe Plastic Deformation, NanoSPD5
PublisherTrans Tech Publications
Pages755-759
Number of pages5
ISBN (Print)9783037850077
DOIs
Publication statusPublished - 2011
Externally publishedYes
EventInternational Conference on Nanomaterials by Severe Plastic Deformation 2011 - Nanjing University of Science and Technology , Nanjing, China
Duration: 21 Mar 201125 Mar 2011
Conference number: 5th
http://www.nanospd5.org/

Publication series

NameMaterials Science Forum
Volume667-669
ISSN (Print)0255-5476
ISSN (Electronic)1662-9752

Conference

ConferenceInternational Conference on Nanomaterials by Severe Plastic Deformation 2011
Abbreviated titleNanoSPD5
CountryChina
CityNanjing
Period21/03/1125/03/11
Internet address

Keywords

  • Copper alloy
  • Electrical resistivity
  • Hardness
  • High pressure torsion
  • Ultra fine grain

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