Grain boundary diffusion of Ni in ultra-fine grain copper-lead alloy produced by equal channel angular pressing

J. Ribbe, G. Schmitz, Y. Estrin, S. Divinski

Research output: Chapter in Book/Report/Conference proceedingConference PaperResearchpeer-review

7 Citations (Scopus)


Kinetic characteristics of internal interfaces in ultrafine grained (UFG) materials represent an aspect that is central to their potential applications. Interface diffusion is strongly affected by ultrafine crystallinity and incorporated defects. In the present study the radiotracer technique was applied for measuring grain boundary (GB) diffusion of Ni in UFG Cu-1wt.%Pb alloy. The UFG specimens were prepared by equal channel angular pressing at room temperature. GB diffusion was investigated at room temperature in Harrison's C kinetic regime under conditions in which Ni diffusion - even along general high-angle GBs in pure Cu - would hardly be measurable by the mechanical sectioning (as the corresponding penetration depths would be less than 100 nanometers). The present study highlights the existence of ultra-fast diffusion paths in severely deformed material. An atypical time dependence of the room-temperature diffusion data indicates a quite involved nature of these "fast" diffusion paths in the Cu-1wt.%Pb alloy.

Original languageEnglish
Title of host publicationDiffusion in Materials - DIMAT2008
Number of pages6
Publication statusPublished - 2009
Event7th International Conference on Diffusion in Materials - Lanzarote, Spain
Duration: 28 Oct 200831 Oct 2008

Publication series

NameDefect and Diffusion Forum
ISSN (Print)1012-0386


Conference7th International Conference on Diffusion in Materials


  • Copper
  • Copper alloy
  • Equal channel angular pressing
  • Grain boundary diffusion
  • Non-equilibrium grain boundary

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