Function of layer thickness on the microstructural evolution in copper of annealed roll-bonded CuNb composites

S. C.V. Lim; A. D. Rollett

Function of layer thickness on the microstructural evolution in copper of annealed roll-bonded CuNb composites

Research output: Chapter in Book/Report/Conference proceeding › Conference Paper › Research › peer-review

Abstract

In this study, recrystallization textures of monolithic pure Cu and alloyed Cu - C19210, with and without Nb reinforcement were investigated. Roll-bonded samples of different layered length scales were deformed to reductions of 70-90% and annealed at temperatures between 300°C and 800°C for 0.5 hours. We found that the Cube and {215}<211> orientations were the dominant components in the recrystallized texture of monolithic pure Cu and alloyed Cu respectively. However, rolling texture was retained for the sub-micron Cu layers of the composites. X-ray analysis and EBSD was used to study the recrystallization evolution of the Cu in the composites. We also propose a term - "confined recrystallization" to explain the effect of the length scale of the Cu layer thickness on the recrystallization texture and microstructural evolution especially in the sub-micron range.

Original language	English
Title of host publication	Applications of Texture Analysis - A Collection of Papers Presented at the 15th International Conference on Textures of Materials, ICOTOM 15
Pages	481-488
Number of pages	8
Publication status	Published - 22 Dec 2008
Externally published	Yes
Event	International Conference on the Textures of Materials (ICOTOM) 2008 - Pittsburgh, United States of America Duration: 1 Jun 2008 → 6 Jun 2008 Conference number: 15th

Publication series

Name	Ceramic Transactions
Volume	201
ISSN (Print)	1042-1122

Conference

Conference	International Conference on the Textures of Materials (ICOTOM) 2008
Abbreviated title	ICOTOM 2008
Country/Territory	United States of America
City	Pittsburgh
Period	1/06/08 → 6/06/08

Keywords

Annealing
Composite
Length-scale
Roll-bonding
Texture

Cite this

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title = "Function of layer thickness on the microstructural evolution in copper of annealed roll-bonded CuNb composites",

abstract = "In this study, recrystallization textures of monolithic pure Cu and alloyed Cu - C19210, with and without Nb reinforcement were investigated. Roll-bonded samples of different layered length scales were deformed to reductions of 70-90% and annealed at temperatures between 300°C and 800°C for 0.5 hours. We found that the Cube and {215}<211> orientations were the dominant components in the recrystallized texture of monolithic pure Cu and alloyed Cu respectively. However, rolling texture was retained for the sub-micron Cu layers of the composites. X-ray analysis and EBSD was used to study the recrystallization evolution of the Cu in the composites. We also propose a term - {"}confined recrystallization{"} to explain the effect of the length scale of the Cu layer thickness on the recrystallization texture and microstructural evolution especially in the sub-micron range.",

keywords = "Annealing, Composite, Length-scale, Roll-bonding, Texture",

author = "Lim, {S. C.V.} and Rollett, {A. D.}",

year = "2008",

month = dec,

day = "22",

language = "English",

isbn = "9780470408353",

series = "Ceramic Transactions",

pages = "481--488",

booktitle = "Applications of Texture Analysis - A Collection of Papers Presented at the 15th International Conference on Textures of Materials, ICOTOM 15",

note = "International Conference on the Textures of Materials (ICOTOM) 2008, ICOTOM 2008 ; Conference date: 01-06-2008 Through 06-06-2008",

}

Lim, SCV & Rollett, AD 2008, Function of layer thickness on the microstructural evolution in copper of annealed roll-bonded CuNb composites. in Applications of Texture Analysis - A Collection of Papers Presented at the 15th International Conference on Textures of Materials, ICOTOM 15. Ceramic Transactions, vol. 201, pp. 481-488, International Conference on the Textures of Materials (ICOTOM) 2008, Pittsburgh, Pennsylvania, United States of America, 1/06/08.

Function of layer thickness on the microstructural evolution in copper of annealed roll-bonded CuNb composites. / Lim, S. C.V.; Rollett, A. D.

Applications of Texture Analysis - A Collection of Papers Presented at the 15th International Conference on Textures of Materials, ICOTOM 15. 2008. p. 481-488 (Ceramic Transactions; Vol. 201).

Research output: Chapter in Book/Report/Conference proceeding › Conference Paper › Research › peer-review

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T1 - Function of layer thickness on the microstructural evolution in copper of annealed roll-bonded CuNb composites

AU - Lim, S. C.V.

AU - Rollett, A. D.

N1 - Conference code: 15th

PY - 2008/12/22

Y1 - 2008/12/22

N2 - In this study, recrystallization textures of monolithic pure Cu and alloyed Cu - C19210, with and without Nb reinforcement were investigated. Roll-bonded samples of different layered length scales were deformed to reductions of 70-90% and annealed at temperatures between 300°C and 800°C for 0.5 hours. We found that the Cube and {215}<211> orientations were the dominant components in the recrystallized texture of monolithic pure Cu and alloyed Cu respectively. However, rolling texture was retained for the sub-micron Cu layers of the composites. X-ray analysis and EBSD was used to study the recrystallization evolution of the Cu in the composites. We also propose a term - "confined recrystallization" to explain the effect of the length scale of the Cu layer thickness on the recrystallization texture and microstructural evolution especially in the sub-micron range.

AB - In this study, recrystallization textures of monolithic pure Cu and alloyed Cu - C19210, with and without Nb reinforcement were investigated. Roll-bonded samples of different layered length scales were deformed to reductions of 70-90% and annealed at temperatures between 300°C and 800°C for 0.5 hours. We found that the Cube and {215}<211> orientations were the dominant components in the recrystallized texture of monolithic pure Cu and alloyed Cu respectively. However, rolling texture was retained for the sub-micron Cu layers of the composites. X-ray analysis and EBSD was used to study the recrystallization evolution of the Cu in the composites. We also propose a term - "confined recrystallization" to explain the effect of the length scale of the Cu layer thickness on the recrystallization texture and microstructural evolution especially in the sub-micron range.

KW - Annealing

KW - Composite

KW - Length-scale

KW - Roll-bonding

KW - Texture

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M3 - Conference Paper

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SN - 9780470408353

T3 - Ceramic Transactions

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EP - 488

BT - Applications of Texture Analysis - A Collection of Papers Presented at the 15th International Conference on Textures of Materials, ICOTOM 15

T2 - International Conference on the Textures of Materials (ICOTOM) 2008

Y2 - 1 June 2008 through 6 June 2008

ER -

Function of layer thickness on the microstructural evolution in copper of annealed roll-bonded CuNb composites

Abstract

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Keywords

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