Function of layer thickness on the microstructural evolution in copper of annealed roll-bonded CuNb composites

S. C.V. Lim, A. D. Rollett

Research output: Chapter in Book/Report/Conference proceedingConference PaperResearchpeer-review


In this study, recrystallization textures of monolithic pure Cu and alloyed Cu - C19210, with and without Nb reinforcement were investigated. Roll-bonded samples of different layered length scales were deformed to reductions of 70-90% and annealed at temperatures between 300°C and 800°C for 0.5 hours. We found that the Cube and {215}<211> orientations were the dominant components in the recrystallized texture of monolithic pure Cu and alloyed Cu respectively. However, rolling texture was retained for the sub-micron Cu layers of the composites. X-ray analysis and EBSD was used to study the recrystallization evolution of the Cu in the composites. We also propose a term - "confined recrystallization" to explain the effect of the length scale of the Cu layer thickness on the recrystallization texture and microstructural evolution especially in the sub-micron range.

Original languageEnglish
Title of host publicationApplications of Texture Analysis - A Collection of Papers Presented at the 15th International Conference on Textures of Materials, ICOTOM 15
Number of pages8
Publication statusPublished - 22 Dec 2008
Externally publishedYes
EventInternational Conference on the Textures of Materials (ICOTOM) 2008 - Pittsburgh, United States of America
Duration: 1 Jun 20086 Jun 2008
Conference number: 15th

Publication series

NameCeramic Transactions
ISSN (Print)1042-1122


ConferenceInternational Conference on the Textures of Materials (ICOTOM) 2008
Abbreviated titleICOTOM 2008
Country/TerritoryUnited States of America


  • Annealing
  • Composite
  • Length-scale
  • Roll-bonding
  • Texture

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