Friction effects during open-die micro-forging/extrusion processes: An upper bound approach

Ehsan Ghassemali; Ming-Jen Tan; Chua Beng Wah; Samuel C.V. Lim; Anders E.W. Jarfors

doi:10.1016/j.proeng.2014.10.256

Friction effects during open-die micro-forging/extrusion processes: An upper bound approach

Ehsan Ghassemali, Ming-Jen Tan, Chua Beng Wah, Samuel C.V. Lim, Anders E.W. Jarfors

Materials Science & Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference Paper › Research › peer-review

7 Citations (Scopus)

Abstract

In microforming processes it is preferred to not to use lubricants, due to their complex behavior in micro-scale. Nevertheless, using lubricants could increase the life time and decrease the required forming load. Thus, it is necessary to study and develop an analytical solution for different lubrication conditions in microforming processes. A previously studied upper bound model was modified in this study for various lubrication conditions in an open-die micro-forging/extrusion process. Two approaches were chosen for identifying the friction factor in the model: (i) global friction factor, (ii) localized friction factor. Comparison of the modeling results with the experimental showed the reliability of the second approach, providing a better fit.

Original language	English
Title of host publication	11th International Conference on Technology of Plasticity, ICTP 2014
Subtitle of host publication	19-24 October 2014; Nagoya, Japan
Editors	Takashi Ishikawa, Ken-ichiro Mori
Publisher	Elsevier
Pages	1915-1920
Number of pages	6
DOIs	https://doi.org/10.1016/j.proeng.2014.10.256
Publication status	Published - 2014
Event	International Conference on Technology of Plasticity 2014 - Nagoya Congress Center, Nagoya, Japan Duration: 19 Oct 2014 → 24 Oct 2014 Conference number: 11th https://www.sciencedirect.com/journal/procedia-engineering/vol/81 https://www.sciencedirect.com/journal/procedia-engineering/vol/81/suppl/C

Publication series

Name	Procedia Engineering
Publisher	Elsevier BV
Volume	81
ISSN (Electronic)	1877-7058

Conference

Conference	International Conference on Technology of Plasticity 2014
Abbreviated title	ICTP 2014
Country/Territory	Japan
City	Nagoya
Period	19/10/14 → 24/10/14
Other	Procedia Engineering Volume 81
Internet address	https://www.sciencedirect.com/journal/procedia-engineering/vol/81 https://www.sciencedirect.com/journal/procedia-engineering/vol/81/suppl/C

Keywords

Friction
Microforming
Microstructure
Size effect

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10.1016/j.proeng.2014.10.256Licence: CC BY-NC-ND

51651689-oaFinal published version, 387 KBLicence: CC BY-NC-ND

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Ghassemali, E., Tan, M-J., Wah, C. B., Lim, S. C. V., & Jarfors, A. E. W. (2014). Friction effects during open-die micro-forging/extrusion processes: An upper bound approach. In T. Ishikawa, & K. Mori (Eds.), 11th International Conference on Technology of Plasticity, ICTP 2014: 19-24 October 2014; Nagoya, Japan (pp. 1915-1920). (Procedia Engineering; Vol. 81). Elsevier. https://doi.org/10.1016/j.proeng.2014.10.256

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abstract = "In microforming processes it is preferred to not to use lubricants, due to their complex behavior in micro-scale. Nevertheless, using lubricants could increase the life time and decrease the required forming load. Thus, it is necessary to study and develop an analytical solution for different lubrication conditions in microforming processes. A previously studied upper bound model was modified in this study for various lubrication conditions in an open-die micro-forging/extrusion process. Two approaches were chosen for identifying the friction factor in the model: (i) global friction factor, (ii) localized friction factor. Comparison of the modeling results with the experimental showed the reliability of the second approach, providing a better fit.",

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note = "International Conference on Technology of Plasticity 2014, ICTP 2014 ; Conference date: 19-10-2014 Through 24-10-2014",

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Ghassemali, E, Tan, M-J, Wah, CB, Lim, SCV & Jarfors, AEW 2014, Friction effects during open-die micro-forging/extrusion processes: An upper bound approach. in T Ishikawa & K Mori (eds), 11th International Conference on Technology of Plasticity, ICTP 2014: 19-24 October 2014; Nagoya, Japan. Procedia Engineering, vol. 81, Elsevier, pp. 1915-1920, International Conference on Technology of Plasticity 2014, Nagoya, Japan, 19/10/14. https://doi.org/10.1016/j.proeng.2014.10.256

Friction effects during open-die micro-forging/extrusion processes : An upper bound approach. / Ghassemali, Ehsan; Tan, Ming-Jen; Wah, Chua Beng et al.

11th International Conference on Technology of Plasticity, ICTP 2014: 19-24 October 2014; Nagoya, Japan. ed. / Takashi Ishikawa; Ken-ichiro Mori. Elsevier, 2014. p. 1915-1920 (Procedia Engineering; Vol. 81).

Research output: Chapter in Book/Report/Conference proceeding › Conference Paper › Research › peer-review

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AB - In microforming processes it is preferred to not to use lubricants, due to their complex behavior in micro-scale. Nevertheless, using lubricants could increase the life time and decrease the required forming load. Thus, it is necessary to study and develop an analytical solution for different lubrication conditions in microforming processes. A previously studied upper bound model was modified in this study for various lubrication conditions in an open-die micro-forging/extrusion process. Two approaches were chosen for identifying the friction factor in the model: (i) global friction factor, (ii) localized friction factor. Comparison of the modeling results with the experimental showed the reliability of the second approach, providing a better fit.

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Ghassemali E, Tan M-J, Wah CB, Lim SCV, Jarfors AEW. Friction effects during open-die micro-forging/extrusion processes: An upper bound approach. In Ishikawa T, Mori K, editors, 11th International Conference on Technology of Plasticity, ICTP 2014: 19-24 October 2014; Nagoya, Japan. Elsevier. 2014. p. 1915-1920. (Procedia Engineering). https://doi.org/10.1016/j.proeng.2014.10.256

Friction effects during open-die micro-forging/extrusion processes: An upper bound approach

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