Finite element modeling of copper wire bonding on a stacked-die in semiconductor devices

Xin Kai Tam, Pooria Pasbakhsh, Ningqun Guo, Norhazlina Ismail, Kheng Lim Goh

Research output: Contribution to journal › Article › Research › peer-review

Original language	English
Pages (from-to)	924 - 927
Number of pages	4
Journal	International Journal of Computer Theory and Engineering
Volume	5
Issue number	6
DOIs	https://doi.org/10.7763/IJCTE.2013.V5.824
Publication status	Published - 2013

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title = "Finite element modeling of copper wire bonding on a stacked-die in semiconductor devices",

author = "Tam, \{Xin Kai\} and Pooria Pasbakhsh and Ningqun Guo and Norhazlina Ismail and Goh, \{Kheng Lim\}",

year = "2013",

doi = "10.7763/IJCTE.2013.V5.824",

language = "English",

volume = "5",

pages = "924 -- 927",

journal = "International Journal of Computer Theory and Engineering",

issn = "1793-8201",

number = "6",

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TY - JOUR

T1 - Finite element modeling of copper wire bonding on a stacked-die in semiconductor devices

AU - Tam, Xin Kai

AU - Pasbakhsh, Pooria

AU - Guo, Ningqun

AU - Ismail, Norhazlina

AU - Goh, Kheng Lim

PY - 2013

Y1 - 2013

U2 - 10.7763/IJCTE.2013.V5.824

DO - 10.7763/IJCTE.2013.V5.824

M3 - Article

SN - 1793-8201

VL - 5

SP - 924

EP - 927

JO - International Journal of Computer Theory and Engineering

JF - International Journal of Computer Theory and Engineering

IS - 6

ER -