Finite element modeling of copper wire bonding on a stacked-die in semiconductor devices

Xin Kai Tam, Pooria Pasbakhsh, Ningqun Guo, Norhazlina Ismail, Kheng Lim Goh

    Research output: Contribution to journalArticleResearchpeer-review

    Original languageEnglish
    Pages (from-to)924 - 927
    Number of pages4
    JournalInternational Journal of Computer Theory and Engineering
    Issue number6
    Publication statusPublished - 2013

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