Fast femtosecond laser ablation for efficient cutting of sintered alumina and quartz substrates

Reece N. Oosterbeek; Thomas Ward; Carsten Corazza; Owen Bodley; Simon Ashforth; Andrew Rodda; M. Cather Simpson

Fast femtosecond laser ablation for efficient cutting of sintered alumina and quartz substrates

Reece N. Oosterbeek, Thomas Ward, Carsten Corazza, Owen Bodley, Simon Ashforth, Andrew Rodda, M. Cather Simpson

Research output: Chapter in Book/Report/Conference proceeding › Conference Paper › Other › peer-review

Abstract

Ultrafast laser machining of ceramic and crystalline substrates offers many benefits versus mechanical dicing. We optimized femtosecond laser parameters for cutting industry sintered alumina and quartz wafers, yielding drastic improvements in cutting speed and quality.

Original language	English
Title of host publication	Conference on Lasers and Electro-Optics (CLEO 2016)
Subtitle of host publication	5-10 June 2016, San Jose, California, USA
Publisher	IEEE, Institute of Electrical and Electronics Engineers
ISBN (Electronic)	9781943580118
Publication status	Published - 16 Dec 2016
Externally published	Yes
Event	Conference on Lasers and Electro-Optics 2016 - San Jose, United States of America Duration: 5 Jun 2016 → 10 Jun 2016 https://ieeexplore.ieee.org/xpl/conhome/7756233/proceeding (Proceedings)

Conference

Conference	Conference on Lasers and Electro-Optics 2016
Abbreviated title	CLEO 2016
Country/Territory	United States of America
City	San Jose
Period	5/06/16 → 10/06/16
Internet address	https://ieeexplore.ieee.org/xpl/conhome/7756233/proceeding (Proceedings)

Cite this

Oosterbeek, R. N., Ward, T., Corazza, C., Bodley, O., Ashforth, S., Rodda, A., & Simpson, M. C. (2016). Fast femtosecond laser ablation for efficient cutting of sintered alumina and quartz substrates. In Conference on Lasers and Electro-Optics (CLEO 2016): 5-10 June 2016, San Jose, California, USA Article 7788287 IEEE, Institute of Electrical and Electronics Engineers.

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title = "Fast femtosecond laser ablation for efficient cutting of sintered alumina and quartz substrates",

abstract = "Ultrafast laser machining of ceramic and crystalline substrates offers many benefits versus mechanical dicing. We optimized femtosecond laser parameters for cutting industry sintered alumina and quartz wafers, yielding drastic improvements in cutting speed and quality.",

author = "Oosterbeek, \{Reece N.\} and Thomas Ward and Carsten Corazza and Owen Bodley and Simon Ashforth and Andrew Rodda and Simpson, \{M. Cather\}",

year = "2016",

month = dec,

day = "16",

language = "English",

booktitle = "Conference on Lasers and Electro-Optics (CLEO 2016)",

publisher = "IEEE, Institute of Electrical and Electronics Engineers",

address = "United States of America",

note = "Conference on Lasers and Electro-Optics 2016, CLEO 2016 ; Conference date: 05-06-2016 Through 10-06-2016",

url = "https://ieeexplore.ieee.org/xpl/conhome/7756233/proceeding",

}

Oosterbeek, RN, Ward, T, Corazza, C, Bodley, O, Ashforth, S, Rodda, A & Simpson, MC 2016, Fast femtosecond laser ablation for efficient cutting of sintered alumina and quartz substrates. in Conference on Lasers and Electro-Optics (CLEO 2016): 5-10 June 2016, San Jose, California, USA., 7788287, IEEE, Institute of Electrical and Electronics Engineers, Conference on Lasers and Electro-Optics 2016, San Jose, California, United States of America, 5/06/16.

Fast femtosecond laser ablation for efficient cutting of sintered alumina and quartz substrates. / Oosterbeek, Reece N.; Ward, Thomas; Corazza, Carsten et al.
Conference on Lasers and Electro-Optics (CLEO 2016): 5-10 June 2016, San Jose, California, USA. IEEE, Institute of Electrical and Electronics Engineers, 2016. 7788287.

Research output: Chapter in Book/Report/Conference proceeding › Conference Paper › Other › peer-review

TY - GEN

T1 - Fast femtosecond laser ablation for efficient cutting of sintered alumina and quartz substrates

AU - Oosterbeek, Reece N.

AU - Ward, Thomas

AU - Corazza, Carsten

AU - Bodley, Owen

AU - Ashforth, Simon

AU - Rodda, Andrew

AU - Simpson, M. Cather

PY - 2016/12/16

Y1 - 2016/12/16

N2 - Ultrafast laser machining of ceramic and crystalline substrates offers many benefits versus mechanical dicing. We optimized femtosecond laser parameters for cutting industry sintered alumina and quartz wafers, yielding drastic improvements in cutting speed and quality.

AB - Ultrafast laser machining of ceramic and crystalline substrates offers many benefits versus mechanical dicing. We optimized femtosecond laser parameters for cutting industry sintered alumina and quartz wafers, yielding drastic improvements in cutting speed and quality.

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M3 - Conference Paper

AN - SCOPUS:85010701110

BT - Conference on Lasers and Electro-Optics (CLEO 2016)

PB - IEEE, Institute of Electrical and Electronics Engineers

T2 - Conference on Lasers and Electro-Optics 2016

Y2 - 5 June 2016 through 10 June 2016

ER -

Fast femtosecond laser ablation for efficient cutting of sintered alumina and quartz substrates

Abstract

Conference

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