Fast femtosecond laser ablation for efficient cutting of sintered alumina and quartz substrates

Reece N. Oosterbeek, Thomas Ward, Carsten Corazza, Owen Bodley, Simon Ashforth, Andrew Rodda, M. Cather Simpson

Research output: Chapter in Book/Report/Conference proceedingConference PaperOtherpeer-review

3 Citations (Scopus)


Ultrafast laser machining of ceramic and crystalline substrates offers many benefits versus mechanical dicing. We optimized femtosecond laser parameters for cutting industry sintered alumina and quartz wafers, yielding drastic improvements in cutting speed and quality.

Original languageEnglish
Title of host publicationConference on Lasers and Electro-Optics (CLEO 2016)
Subtitle of host publication5-10 June 2016, San Jose, California, USA
PublisherIEEE, Institute of Electrical and Electronics Engineers
ISBN (Electronic)9781943580118
Publication statusPublished - 16 Dec 2016
Externally publishedYes
EventConference on Lasers and Electro-Optics 2016 - San Jose, United States of America
Duration: 5 Jun 201610 Jun 2016 (Proceedings)


ConferenceConference on Lasers and Electro-Optics 2016
Abbreviated titleCLEO 2016
CountryUnited States of America
CitySan Jose
Internet address

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