Failure analysis of plastic packaged optocoupler light emitting diodes

Nam Hwang, P. S.R. Naidu, A. Trigg

Research output: Chapter in Book/Report/Conference proceedingConference PaperOtherpeer-review

10 Citations (Scopus)

Abstract

Failure mechanisms in plastic packaged optocouplers have been investigated. The high failure rate of the optocouplers, specifically the reverse bias leakage current of the light emitting diodes (LEDs), was found to be moisture-related. Using scanning electron microscopy coupled with energy dispersive X-ray microanalysis, a significant concentration of copper was detected on the surface of failed LEDs, possibly migrated from the copper leadframe. By applying infra-red photoemission microscopy it was found that bandgap emission was associated with the reverse leakage path in the area of the pn junction of the LEDs.

Original languageEnglish
Title of host publicationProceedings of 5th Electronics Packaging Technology Conference, EPTC 2003
EditorsMahadevan K. Iyer, Yew Cheong Mui, Kok Chuan Toh
PublisherIEEE, Institute of Electrical and Electronics Engineers
Pages346-349
Number of pages4
ISBN (Electronic)0780382056, 9780780382053
DOIs
Publication statusPublished - 1 Jan 2003
Externally publishedYes
Event5th Electronics Packaging Technology Conference, EPTC 2003 - Singapore, Singapore
Duration: 10 Dec 200312 Dec 2003

Publication series

NameProceedings of 5th Electronics Packaging Technology Conference, EPTC 2003

Conference

Conference5th Electronics Packaging Technology Conference, EPTC 2003
CountrySingapore
CitySingapore
Period10/12/0312/12/03

Cite this