Evaluation of quality of silicon/copper interfaces in IC packaging

J. Abdul; Y. Wang; N. Guo; A. Rehman; K. C. Chan

Evaluation of quality of silicon/copper interfaces in IC packaging

J. Abdul, Y. Wang, N. Guo, A. Rehman, K. C. Chan

Research output: Chapter in Book/Report/Conference proceeding › Conference Paper › Other

Abstract

The quality of the interfaces that typically exist in integrated circuit (IC) packages was evaluated by using longitudinal ultrasonic wave propagation with contact transducers. An interface spring model was used to predict the ultrasonic reflection coefficient relationship with varying interfacial spring constants. Results demonstrate that the quantification of the interface quality is possible, and reflection coefficient can be used as a criterion.

Original language	English
Title of host publication	Electronic Components & Technology Conference May 21-24, 2000
Publisher	IEEE, Institute of Electrical and Electronics Engineers
Pages	1594-1599
Number of pages	6
Publication status	Published - 2000
Externally published	Yes
Event	Electronic Components and Technology Conference 2000 - Las Vegas, United States of America Duration: 21 May 2000 → 24 May 2000 https://ieeexplore.ieee.org/xpl/conhome/6887/proceeding (Proceedings)

Publication series

Name	Proceedings - Electronic Components and Technology Conference
ISSN (Print)	0569-5503

Conference

Conference	Electronic Components and Technology Conference 2000
Abbreviated title	ECTC 2000
Country/Territory	United States of America
City	Las Vegas
Period	21/05/00 → 24/05/00
Internet address	https://ieeexplore.ieee.org/xpl/conhome/6887/proceeding (Proceedings)

Cite this

@inproceedings{95727882fd744567861c7b93dac82d9b,

title = "Evaluation of quality of silicon/copper interfaces in IC packaging",

abstract = "The quality of the interfaces that typically exist in integrated circuit (IC) packages was evaluated by using longitudinal ultrasonic wave propagation with contact transducers. An interface spring model was used to predict the ultrasonic reflection coefficient relationship with varying interfacial spring constants. Results demonstrate that the quantification of the interface quality is possible, and reflection coefficient can be used as a criterion.",

author = "J. Abdul and Y. Wang and N. Guo and A. Rehman and Chan, {K. C.}",

year = "2000",

language = "English",

series = "Proceedings - Electronic Components and Technology Conference",

publisher = "IEEE, Institute of Electrical and Electronics Engineers",

pages = "1594--1599",

booktitle = "Electronic Components & Technology Conference May 21-24, 2000",

address = "United States of America",

url = "https://ieeexplore.ieee.org/xpl/conhome/6887/proceeding",

}

Abdul, J, Wang, Y, Guo, N, Rehman, A & Chan, KC 2000, Evaluation of quality of silicon/copper interfaces in IC packaging. in Electronic Components & Technology Conference May 21-24, 2000. Proceedings - Electronic Components and Technology Conference, IEEE, Institute of Electrical and Electronics Engineers, pp. 1594-1599, Electronic Components and Technology Conference 2000, Las Vegas, Nevada, United States of America, 21/05/00.

Evaluation of quality of silicon/copper interfaces in IC packaging. / Abdul, J.; Wang, Y.; Guo, N. et al.
Electronic Components & Technology Conference May 21-24, 2000. IEEE, Institute of Electrical and Electronics Engineers, 2000. p. 1594-1599 (Proceedings - Electronic Components and Technology Conference).

Research output: Chapter in Book/Report/Conference proceeding › Conference Paper › Other

TY - GEN

T1 - Evaluation of quality of silicon/copper interfaces in IC packaging

AU - Abdul, J.

AU - Wang, Y.

AU - Guo, N.

AU - Rehman, A.

AU - Chan, K. C.

PY - 2000

Y1 - 2000

N2 - The quality of the interfaces that typically exist in integrated circuit (IC) packages was evaluated by using longitudinal ultrasonic wave propagation with contact transducers. An interface spring model was used to predict the ultrasonic reflection coefficient relationship with varying interfacial spring constants. Results demonstrate that the quantification of the interface quality is possible, and reflection coefficient can be used as a criterion.

AB - The quality of the interfaces that typically exist in integrated circuit (IC) packages was evaluated by using longitudinal ultrasonic wave propagation with contact transducers. An interface spring model was used to predict the ultrasonic reflection coefficient relationship with varying interfacial spring constants. Results demonstrate that the quantification of the interface quality is possible, and reflection coefficient can be used as a criterion.

UR - http://www.scopus.com/inward/record.url?scp=0034479235&partnerID=8YFLogxK

M3 - Conference Paper

AN - SCOPUS:0034479235

T3 - Proceedings - Electronic Components and Technology Conference

SP - 1594

EP - 1599

BT - Electronic Components & Technology Conference May 21-24, 2000

PB - IEEE, Institute of Electrical and Electronics Engineers

T2 - Electronic Components and Technology Conference 2000

Y2 - 21 May 2000 through 24 May 2000

ER -

Evaluation of quality of silicon/copper interfaces in IC packaging

Abstract

Publication series

Conference

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Cite this