Evaluation of quality of silicon/copper interfaces in IC packaging

J. Abdul, Y. Wang, N. Guo, A. Rehman, K. C. Chan

Research output: Chapter in Book/Report/Conference proceedingConference PaperOther

Abstract

The quality of the interfaces that typically exist in integrated circuit (IC) packages was evaluated by using longitudinal ultrasonic wave propagation with contact transducers. An interface spring model was used to predict the ultrasonic reflection coefficient relationship with varying interfacial spring constants. Results demonstrate that the quantification of the interface quality is possible, and reflection coefficient can be used as a criterion.

Original languageEnglish
Title of host publicationElectronic Components & Technology Conference May 21-24, 2000
PublisherIEEE, Institute of Electrical and Electronics Engineers
Pages1594-1599
Number of pages6
Publication statusPublished - 2000
Externally publishedYes
EventElectronic Components and Technology Conference 2000 - Las Vegas, United States of America
Duration: 21 May 200024 May 2000
https://ieeexplore.ieee.org/xpl/conhome/6887/proceeding (Proceedings)

Publication series

NameProceedings - Electronic Components and Technology Conference
ISSN (Print)0569-5503

Conference

ConferenceElectronic Components and Technology Conference 2000
Abbreviated titleECTC 2000
CountryUnited States of America
CityLas Vegas
Period21/05/0024/05/00
Internet address

Cite this