Effect of residual stresses caused by thermal treatment oncreep crack growth rate in aluminium gas cylinders

Raafat Ibrahim, Dmitry Ischenko

Research output: Chapter in Book/Report/Conference proceedingConference PaperOther

Abstract

Aluminum gas cylinders, which are in common use forvarious purposes, are susceptible to creep crack growth.Residual stresses introduced during the quenching process inaluminum gas cylinders contribute to the development ofcracks. This may result in leakage or fracture of the cylinders.Finite element studies were conducted to evaluate the effect ofthe quenching process on through thickness inelastic strainand the residual stress distributions in the neck area of gascylinders. Numerical modeling and experimental studiesconfirmed that a high level of tensile residual stresses exists onthe inner surface of aluminum gas cylinders' neck which issusceptible to cracking. The relationship between the amountof residual stresses and cooling conditions was established.The obtained residual stress distributions were included in thecalculation of the creep crack growth rates. It was shown thatresidual stresses caused by manufacturing processes have asignificant effect on the creep crack growth rate.

Original languageEnglish
Title of host publication24th Design Automation Conference
PublisherAmerican Society of Mechanical Engineers (ASME)
ISBN (Electronic)9780791880326
DOIs
Publication statusPublished - 1998
EventASME International Design Engineering Technical Conferences & Computers and Information in Engineering Conference (IDETC/CIE) 1998 - Atlanta, USA, Fairfield NJ USA
Duration: 1 Jan 1998 → …

Publication series

NameProceedings of the ASME Design Engineering Technical Conference
Volume2

Conference

ConferenceASME International Design Engineering Technical Conferences & Computers and Information in Engineering Conference (IDETC/CIE) 1998
CityFairfield NJ USA
Period1/01/98 → …

Keywords

  • Aluminum gas cylinders
  • Crack growth rate
  • Finite element analysis
  • Quenching
  • Residual stresses

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