Effect of back pressure on the thermal stability of severely deformed copper

Yali Wang, Rimma Ye Lapovok, Jing Tao Wang, Yuri Estrin

Research output: Chapter in Book/Report/Conference proceedingConference PaperResearchpeer-review

Original languageEnglish
Title of host publicationIOP Conference Series: Materials Science and Engineering
EditorsLaszlo S Toth, Benoit Beausir, Olivier Bouaziz, Emmanuel Bouzy, Thierry Grosdidier
Place of PublicationBristol UK
PublisherInstitute of Physics Publishing (IOP Publishing)
Pages1 - 10
Number of pages10
Volume63
ISBN (Print)1757-8981
DOIs
Publication statusPublished - 2014
EventInternational Conference on Nanomaterials by Severe Plastic Deformation 2014 - Metz, France
Duration: 30 Jun 20144 Jul 2014
Conference number: 6th
http://iopscience.iop.org/article/10.1088/1757-899X/63/1/011001/pdf

Conference

ConferenceInternational Conference on Nanomaterials by Severe Plastic Deformation 2014
Abbreviated titleNanoSPD6 2014
CountryFrance
CityMetz
Period30/06/144/07/14
OtherIOP Conf. Series: Materials Science and Engineering 63 (2014)
Internet address

Cite this

Wang, Y., Lapovok, R. Y., Wang, J. T., & Estrin, Y. (2014). Effect of back pressure on the thermal stability of severely deformed copper. In L. S. Toth, B. Beausir, O. Bouaziz, E. Bouzy, & T. Grosdidier (Eds.), IOP Conference Series: Materials Science and Engineering (Vol. 63, pp. 1 - 10). Bristol UK: Institute of Physics Publishing (IOP Publishing). https://doi.org/10.1088/1757-899X/63/1/012168
Wang, Yali ; Lapovok, Rimma Ye ; Wang, Jing Tao ; Estrin, Yuri. / Effect of back pressure on the thermal stability of severely deformed copper. IOP Conference Series: Materials Science and Engineering. editor / Laszlo S Toth ; Benoit Beausir ; Olivier Bouaziz ; Emmanuel Bouzy ; Thierry Grosdidier. Vol. 63 Bristol UK : Institute of Physics Publishing (IOP Publishing), 2014. pp. 1 - 10
@inproceedings{4490979ea86043679098fe6bf3d20523,
title = "Effect of back pressure on the thermal stability of severely deformed copper",
author = "Yali Wang and Lapovok, {Rimma Ye} and Wang, {Jing Tao} and Yuri Estrin",
year = "2014",
doi = "10.1088/1757-899X/63/1/012168",
language = "English",
isbn = "1757-8981",
volume = "63",
pages = "1 -- 10",
editor = "Toth, {Laszlo S} and Benoit Beausir and Olivier Bouaziz and Emmanuel Bouzy and Thierry Grosdidier",
booktitle = "IOP Conference Series: Materials Science and Engineering",
publisher = "Institute of Physics Publishing (IOP Publishing)",

}

Wang, Y, Lapovok, RY, Wang, JT & Estrin, Y 2014, Effect of back pressure on the thermal stability of severely deformed copper. in LS Toth, B Beausir, O Bouaziz, E Bouzy & T Grosdidier (eds), IOP Conference Series: Materials Science and Engineering. vol. 63, Institute of Physics Publishing (IOP Publishing), Bristol UK, pp. 1 - 10, International Conference on Nanomaterials by Severe Plastic Deformation 2014 , Metz, France, 30/06/14. https://doi.org/10.1088/1757-899X/63/1/012168

Effect of back pressure on the thermal stability of severely deformed copper. / Wang, Yali; Lapovok, Rimma Ye; Wang, Jing Tao; Estrin, Yuri.

IOP Conference Series: Materials Science and Engineering. ed. / Laszlo S Toth; Benoit Beausir; Olivier Bouaziz; Emmanuel Bouzy; Thierry Grosdidier. Vol. 63 Bristol UK : Institute of Physics Publishing (IOP Publishing), 2014. p. 1 - 10.

Research output: Chapter in Book/Report/Conference proceedingConference PaperResearchpeer-review

TY - GEN

T1 - Effect of back pressure on the thermal stability of severely deformed copper

AU - Wang, Yali

AU - Lapovok, Rimma Ye

AU - Wang, Jing Tao

AU - Estrin, Yuri

PY - 2014

Y1 - 2014

UR - http://iopscience.iop.org/1757-899X/63/1/012168/pdf/1757-899X_63_1_012168.pdf

U2 - 10.1088/1757-899X/63/1/012168

DO - 10.1088/1757-899X/63/1/012168

M3 - Conference Paper

SN - 1757-8981

VL - 63

SP - 1

EP - 10

BT - IOP Conference Series: Materials Science and Engineering

A2 - Toth, Laszlo S

A2 - Beausir, Benoit

A2 - Bouaziz, Olivier

A2 - Bouzy, Emmanuel

A2 - Grosdidier, Thierry

PB - Institute of Physics Publishing (IOP Publishing)

CY - Bristol UK

ER -

Wang Y, Lapovok RY, Wang JT, Estrin Y. Effect of back pressure on the thermal stability of severely deformed copper. In Toth LS, Beausir B, Bouaziz O, Bouzy E, Grosdidier T, editors, IOP Conference Series: Materials Science and Engineering. Vol. 63. Bristol UK: Institute of Physics Publishing (IOP Publishing). 2014. p. 1 - 10 https://doi.org/10.1088/1757-899X/63/1/012168