Effect of back pressure on the thermal stability of severely deformed copper

Yali Wang; Rimma Ye Lapovok; Jing Tao Wang; Yuri Estrin

doi:10.1088/1757-899X/63/1/012168

Effect of back pressure on the thermal stability of severely deformed copper

Yali Wang, Rimma Ye Lapovok, Jing Tao Wang, Yuri Estrin

Materials Science & Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference Paper › Research › peer-review

5 Citations (Scopus)

Original language	English
Title of host publication	6th International Conference on Nanomaterials by Severe Plastic Deformation (NanoSPD6) 30 June 2014 to 4 July 2104, Metz, France
Editors	Laszlo S Toth, Benoit Beausir, Olivier Bouaziz, Emmanuel Bouzy, Thierry Grosdidier
Place of Publication	Bristol UK
Publisher	IOP Publishing
Pages	1 - 10
Number of pages	10
DOIs	https://doi.org/10.1088/1757-899X/63/1/012168
Publication status	Published - 2014
Event	International Conference on Nanomaterials by Severe Plastic Deformation 2014 - Metz, France Duration: 30 Jun 2014 → 4 Jul 2014 Conference number: 6th http://iopscience.iop.org/article/10.1088/1757-899X/63/1/011001/pdf

Publication series

Name	IOP Conference Series: Materials Science and Engineering
Publisher	IOP Publishing
Volume	63
ISSN (Print)	1757-8981
ISSN (Electronic)	1757-899X

Conference

Conference	International Conference on Nanomaterials by Severe Plastic Deformation 2014
Abbreviated title	NanoSPD6 2014
Country/Territory	France
City	Metz
Period	30/06/14 → 4/07/14
Other	IOP Conf. Series: Materials Science and Engineering 63 (2014)
Internet address	http://iopscience.iop.org/article/10.1088/1757-899X/63/1/011001/pdf

Access to Document

10.1088/1757-899X/63/1/012168

Centre for Electron Microscopy (MCEM)
Flame Sorrell (Manager) & Peter Miller (Manager)
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Facility/equipment: Facility

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Wang, Y., Lapovok, R. Y., Wang, J. T., & Estrin, Y. (2014). Effect of back pressure on the thermal stability of severely deformed copper. In L. S. Toth, B. Beausir, O. Bouaziz, E. Bouzy, & T. Grosdidier (Eds.), 6th International Conference on Nanomaterials by Severe Plastic Deformation (NanoSPD6) 30 June 2014 to 4 July 2104, Metz, France (pp. 1 - 10). (IOP Conference Series: Materials Science and Engineering; Vol. 63). IOP Publishing. https://doi.org/10.1088/1757-899X/63/1/012168

Wang, Yali ; Lapovok, Rimma Ye ; Wang, Jing Tao et al. / Effect of back pressure on the thermal stability of severely deformed copper. 6th International Conference on Nanomaterials by Severe Plastic Deformation (NanoSPD6) 30 June 2014 to 4 July 2104, Metz, France. editor / Laszlo S Toth ; Benoit Beausir ; Olivier Bouaziz ; Emmanuel Bouzy ; Thierry Grosdidier. Bristol UK : IOP Publishing, 2014. pp. 1 - 10 (IOP Conference Series: Materials Science and Engineering).

@inproceedings{4490979ea86043679098fe6bf3d20523,

title = "Effect of back pressure on the thermal stability of severely deformed copper",

author = "Yali Wang and Lapovok, {Rimma Ye} and Wang, {Jing Tao} and Yuri Estrin",

year = "2014",

doi = "10.1088/1757-899X/63/1/012168",

language = "English",

series = "IOP Conference Series: Materials Science and Engineering",

publisher = "IOP Publishing",

pages = "1 -- 10",

editor = "Toth, {Laszlo S} and Benoit Beausir and Olivier Bouaziz and Emmanuel Bouzy and Thierry Grosdidier",

booktitle = "6th International Conference on Nanomaterials by Severe Plastic Deformation (NanoSPD6) 30 June 2014 to 4 July 2104, Metz, France",

address = "United Kingdom",

note = "International Conference on Nanomaterials by Severe Plastic Deformation 2014 , NanoSPD6 2014 ; Conference date: 30-06-2014 Through 04-07-2014",

url = "http://iopscience.iop.org/article/10.1088/1757-899X/63/1/011001/pdf",

}

Wang, Y, Lapovok, RY, Wang, JT & Estrin, Y 2014, Effect of back pressure on the thermal stability of severely deformed copper. in LS Toth, B Beausir, O Bouaziz, E Bouzy & T Grosdidier (eds), 6th International Conference on Nanomaterials by Severe Plastic Deformation (NanoSPD6) 30 June 2014 to 4 July 2104, Metz, France. IOP Conference Series: Materials Science and Engineering, vol. 63, IOP Publishing, Bristol UK, pp. 1 - 10, International Conference on Nanomaterials by Severe Plastic Deformation 2014 , Metz, France, 30/06/14. https://doi.org/10.1088/1757-899X/63/1/012168

Effect of back pressure on the thermal stability of severely deformed copper. / Wang, Yali; Lapovok, Rimma Ye; Wang, Jing Tao et al.
6th International Conference on Nanomaterials by Severe Plastic Deformation (NanoSPD6) 30 June 2014 to 4 July 2104, Metz, France. ed. / Laszlo S Toth; Benoit Beausir; Olivier Bouaziz; Emmanuel Bouzy; Thierry Grosdidier. Bristol UK: IOP Publishing, 2014. p. 1 - 10 (IOP Conference Series: Materials Science and Engineering; Vol. 63).

Research output: Chapter in Book/Report/Conference proceeding › Conference Paper › Research › peer-review

TY - GEN

T1 - Effect of back pressure on the thermal stability of severely deformed copper

AU - Wang, Yali

AU - Lapovok, Rimma Ye

AU - Wang, Jing Tao

AU - Estrin, Yuri

N1 - Conference code: 6th

PY - 2014

Y1 - 2014

U2 - 10.1088/1757-899X/63/1/012168

DO - 10.1088/1757-899X/63/1/012168

M3 - Conference Paper

T3 - IOP Conference Series: Materials Science and Engineering

SP - 1

EP - 10

BT - 6th International Conference on Nanomaterials by Severe Plastic Deformation (NanoSPD6) 30 June 2014 to 4 July 2104, Metz, France

A2 - Toth, Laszlo S

A2 - Beausir, Benoit

A2 - Bouaziz, Olivier

A2 - Bouzy, Emmanuel

A2 - Grosdidier, Thierry

PB - IOP Publishing

CY - Bristol UK

T2 - International Conference on Nanomaterials by Severe Plastic Deformation 2014

Y2 - 30 June 2014 through 4 July 2014

ER -

Wang Y, Lapovok RY, Wang JT, Estrin Y. Effect of back pressure on the thermal stability of severely deformed copper. In Toth LS, Beausir B, Bouaziz O, Bouzy E, Grosdidier T, editors, 6th International Conference on Nanomaterials by Severe Plastic Deformation (NanoSPD6) 30 June 2014 to 4 July 2104, Metz, France. Bristol UK: IOP Publishing. 2014. p. 1 - 10. (IOP Conference Series: Materials Science and Engineering). doi: 10.1088/1757-899X/63/1/012168

Effect of back pressure on the thermal stability of severely deformed copper

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Conference

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