Disparity-adjusted 3D multi-view video coding with dynamic background modelling

Manoranjan Paul, Christopher J Evans, Mohammad Manzur Murshed

    Research output: Chapter in Book/Report/Conference proceedingConference PaperResearchpeer-review

    9 Citations (Scopus)
    Original languageEnglish
    Title of host publication2013 IEEE International Conference on Image Processing ICIP 2013
    EditorsDavid Taubman, Min Wu
    Place of PublicationPiscataway NJ USA
    PublisherIEEE, Institute of Electrical and Electronics Engineers
    Pages1719 - 1723
    Number of pages5
    ISBN (Print)9781479923403
    Publication statusPublished - 2013
    EventIEEE International Conference on Image Processing 2013 - Melbourne Convention and Exhibition Centre (MCEC), Melbourne, Australia
    Duration: 15 Sep 201318 Sep 2013
    Conference number: 20th
    http://ieeexplore.ieee.org/xpl/mostRecentIssue.jsp?punumber=6726158 (IEEE Conference Proceedings)

    Conference

    ConferenceIEEE International Conference on Image Processing 2013
    Abbreviated titleICIP 2013
    CountryAustralia
    CityMelbourne
    Period15/09/1318/09/13
    Internet address

    Cite this

    Paul, M., Evans, C. J., & Murshed, M. M. (2013). Disparity-adjusted 3D multi-view video coding with dynamic background modelling. In D. Taubman, & M. Wu (Eds.), 2013 IEEE International Conference on Image Processing ICIP 2013 (pp. 1719 - 1723). Piscataway NJ USA: IEEE, Institute of Electrical and Electronics Engineers.
    Paul, Manoranjan ; Evans, Christopher J ; Murshed, Mohammad Manzur. / Disparity-adjusted 3D multi-view video coding with dynamic background modelling. 2013 IEEE International Conference on Image Processing ICIP 2013. editor / David Taubman ; Min Wu. Piscataway NJ USA : IEEE, Institute of Electrical and Electronics Engineers, 2013. pp. 1719 - 1723
    @inproceedings{ce9b23da8c99434d89a7e5a9a42a9b11,
    title = "Disparity-adjusted 3D multi-view video coding with dynamic background modelling",
    author = "Manoranjan Paul and Evans, {Christopher J} and Murshed, {Mohammad Manzur}",
    year = "2013",
    language = "English",
    isbn = "9781479923403",
    pages = "1719 -- 1723",
    editor = "David Taubman and Min Wu",
    booktitle = "2013 IEEE International Conference on Image Processing ICIP 2013",
    publisher = "IEEE, Institute of Electrical and Electronics Engineers",
    address = "United States of America",

    }

    Paul, M, Evans, CJ & Murshed, MM 2013, Disparity-adjusted 3D multi-view video coding with dynamic background modelling. in D Taubman & M Wu (eds), 2013 IEEE International Conference on Image Processing ICIP 2013. IEEE, Institute of Electrical and Electronics Engineers, Piscataway NJ USA, pp. 1719 - 1723, IEEE International Conference on Image Processing 2013, Melbourne, Australia, 15/09/13.

    Disparity-adjusted 3D multi-view video coding with dynamic background modelling. / Paul, Manoranjan; Evans, Christopher J; Murshed, Mohammad Manzur.

    2013 IEEE International Conference on Image Processing ICIP 2013. ed. / David Taubman; Min Wu. Piscataway NJ USA : IEEE, Institute of Electrical and Electronics Engineers, 2013. p. 1719 - 1723.

    Research output: Chapter in Book/Report/Conference proceedingConference PaperResearchpeer-review

    TY - GEN

    T1 - Disparity-adjusted 3D multi-view video coding with dynamic background modelling

    AU - Paul, Manoranjan

    AU - Evans, Christopher J

    AU - Murshed, Mohammad Manzur

    PY - 2013

    Y1 - 2013

    M3 - Conference Paper

    SN - 9781479923403

    SP - 1719

    EP - 1723

    BT - 2013 IEEE International Conference on Image Processing ICIP 2013

    A2 - Taubman, David

    A2 - Wu, Min

    PB - IEEE, Institute of Electrical and Electronics Engineers

    CY - Piscataway NJ USA

    ER -

    Paul M, Evans CJ, Murshed MM. Disparity-adjusted 3D multi-view video coding with dynamic background modelling. In Taubman D, Wu M, editors, 2013 IEEE International Conference on Image Processing ICIP 2013. Piscataway NJ USA: IEEE, Institute of Electrical and Electronics Engineers. 2013. p. 1719 - 1723