Abstract
The development of high aspect ratio (AR) structures is of great interest in several fields such as micro-electro-mechanical systems or microfluidics. In this note we present a new processing method of epoxy materials based on direct write laser (DWL) scanning exposure. In this work, we describe the application of this technique for fast prototyping, and the cost-efficient fabrication of structures with a high AR over 40. Such properties demonstrate the proposed DWL of epoxy materials as a promising candidate for the development of polymer-based microsystems.
| Original language | English |
|---|---|
| Article number | 017003 |
| Pages (from-to) | 1-6 |
| Number of pages | 6 |
| Journal | Journal of Micromechanics and Microengineering |
| Volume | 21 |
| Issue number | 1 |
| DOIs | |
| Publication status | Published - Jan 2011 |
| Externally published | Yes |