Direct writing laser of high aspect ratio epoxy microstructures

V. J. Cadarso, K. Pfeiffer, U. Ostrzinski, J B Bureau, G A Racine, A Voigt, G Gruetzner, J Brugger

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20 Citations (Scopus)

Abstract

The development of high aspect ratio (AR) structures is of great interest in several fields such as micro-electro-mechanical systems or microfluidics. In this note we present a new processing method of epoxy materials based on direct write laser (DWL) scanning exposure. In this work, we describe the application of this technique for fast prototyping, and the cost-efficient fabrication of structures with a high AR over 40. Such properties demonstrate the proposed DWL of epoxy materials as a promising candidate for the development of polymer-based microsystems. 

Original languageEnglish
Article number017003
Pages (from-to)1-6
Number of pages6
JournalJournal of Micromechanics and Microengineering
Volume21
Issue number1
DOIs
Publication statusPublished - Jan 2011
Externally publishedYes

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