Abstract
The development of high aspect ratio (AR) structures is of great interest in several fields such as micro-electro-mechanical systems or microfluidics. In this note we present a new processing method of epoxy materials based on direct write laser (DWL) scanning exposure. In this work, we describe the application of this technique for fast prototyping, and the cost-efficient fabrication of structures with a high AR over 40. Such properties demonstrate the proposed DWL of epoxy materials as a promising candidate for the development of polymer-based microsystems.
Original language | English |
---|---|
Article number | 017003 |
Pages (from-to) | 1-6 |
Number of pages | 6 |
Journal | Journal of Micromechanics and Microengineering |
Volume | 21 |
Issue number | 1 |
DOIs | |
Publication status | Published - Jan 2011 |
Externally published | Yes |