Design and analysis of a Piezo-based decoupled 3-DOF (XY?) micropositioner with large workspace

Tilok Kumar Das; Rifat Shahrear; Bijan Shirinzadeh

doi:10.1109/ICCIT60459.2023.10441640

Design and analysis of a Piezo-based decoupled 3-DOF (XY?) micropositioner with large workspace

Tilok Kumar Das, Rifat Shahrear, Bijan Shirinzadeh

Mechanical & Aerospace Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference Paper › Other

1 Citation (Scopus)

Abstract

This paper presents a piezo-based compliant planer 3-DOF micropositioning stage for decoupled large workspace of the platform. Three piezoelectric actuators inside three double-stairs bridge-type mechanisms were used to drive the output platform in XY? directions. A-3PPR type kinematic chain has been oriented parallelly in such a way to have a rotational symmetry about the centroid. Two different types of prismatic flexure joints with a passive rotary flexure joint were utilized in each kinematic chain. The proposed design focused on the redundancy of the cross-axis coupling effect from the other axes during directional movements. To evaluate the performance, Finite Element Analysis (FEA) has been conducted. The decoupled 3-DOF micropositioning stage is able to maintain the maximum parasitic motion of 0.05% and 1.95 % in the Y and ? directions of their respective directional working range. So, the effect of cross-coupling motion during directional movement can be presumed to be less in this case. Further, the FEA results show that the micropositioning stage has a large work envelope of ±271.1 µm × 235 µm × ± 6.0352 mrad. Moreover, the evaluation of the dynamic characteristics predicts that out-of-plane motion will be less likely to occur. Thus, the 3-DOF micropositioning stage can provide a unidirectional decoupled large range of motions.

Original language	English
Title of host publication	2023 26th International Conference on Computer and Information Technology, ICCIT 2023
Publisher	IEEE, Institute of Electrical and Electronics Engineers
ISBN (Electronic)	9798350359015
DOIs	https://doi.org/10.1109/ICCIT60459.2023.10441640
Publication status	Published - 2023
Event	International Conference on Computer and Information Technology 2023 - Cox's Bazar, Bangladesh Duration: 13 Dec 2023 → 15 Dec 2023 Conference number: 26th https://ieeexplore.ieee.org/xpl/conhome/10440723/proceeding (Proceedings)

Conference

Conference	International Conference on Computer and Information Technology 2023
Abbreviated title	ICCIT 2023
Country/Territory	Bangladesh
City	Cox's Bazar
Period	13/12/23 → 15/12/23
Internet address	https://ieeexplore.ieee.org/xpl/conhome/10440723/proceeding (Proceedings)

Keywords

Compliant mechanism
Cross-coupling effect
Decoupling
Finite Element Analysis (FEA)
Planer motion

Access to Document

10.1109/ICCIT60459.2023.10441640

Cite this

@inproceedings{3e341fd33605437c97e62027d5dc4a6f,

title = "Design and analysis of a Piezo-based decoupled 3-DOF (XY?) micropositioner with large workspace",

abstract = "This paper presents a piezo-based compliant planer 3-DOF micropositioning stage for decoupled large workspace of the platform. Three piezoelectric actuators inside three double-stairs bridge-type mechanisms were used to drive the output platform in XY? directions. A-3PPR type kinematic chain has been oriented parallelly in such a way to have a rotational symmetry about the centroid. Two different types of prismatic flexure joints with a passive rotary flexure joint were utilized in each kinematic chain. The proposed design focused on the redundancy of the cross-axis coupling effect from the other axes during directional movements. To evaluate the performance, Finite Element Analysis (FEA) has been conducted. The decoupled 3-DOF micropositioning stage is able to maintain the maximum parasitic motion of 0.05\% and 1.95 \% in the Y and ? directions of their respective directional working range. So, the effect of cross-coupling motion during directional movement can be presumed to be less in this case. Further, the FEA results show that the micropositioning stage has a large work envelope of ±271.1 µm × 235 µm × ± 6.0352 mrad. Moreover, the evaluation of the dynamic characteristics predicts that out-of-plane motion will be less likely to occur. Thus, the 3-DOF micropositioning stage can provide a unidirectional decoupled large range of motions.",

keywords = "Compliant mechanism, Cross-coupling effect, Decoupling, Finite Element Analysis (FEA), Planer motion",

author = "Das, \{Tilok Kumar\} and Rifat Shahrear and Bijan Shirinzadeh",

note = "Funding Information: This research work is supported by the research grant from Directorate of Research \& Extension (DRE) (project code: CUET/DRE/2022-23/ME/039), and the lab facilities from the Post-graduate Research Laborator, Dept. of Mechanical Engineering, Chittagong University of Engineering \& Technology. Publisher Copyright: {\textcopyright} 2023 IEEE.; International Conference on Computer and Information Technology 2023, ICCIT 2023 ; Conference date: 13-12-2023 Through 15-12-2023",

year = "2023",

doi = "10.1109/ICCIT60459.2023.10441640",

language = "English",

booktitle = "2023 26th International Conference on Computer and Information Technology, ICCIT 2023",

publisher = "IEEE, Institute of Electrical and Electronics Engineers",

address = "United States of America",

url = "https://ieeexplore.ieee.org/xpl/conhome/10440723/proceeding",

}

Das, TK, Shahrear, R & Shirinzadeh, B 2023, Design and analysis of a Piezo-based decoupled 3-DOF (XY?) micropositioner with large workspace. in 2023 26th International Conference on Computer and Information Technology, ICCIT 2023. IEEE, Institute of Electrical and Electronics Engineers, International Conference on Computer and Information Technology 2023, Cox's Bazar, Bangladesh, 13/12/23. https://doi.org/10.1109/ICCIT60459.2023.10441640

Design and analysis of a Piezo-based decoupled 3-DOF (XY?) micropositioner with large workspace. / Das, Tilok Kumar; Shahrear, Rifat; Shirinzadeh, Bijan.
2023 26th International Conference on Computer and Information Technology, ICCIT 2023. IEEE, Institute of Electrical and Electronics Engineers, 2023.

Research output: Chapter in Book/Report/Conference proceeding › Conference Paper › Other

TY - GEN

T1 - Design and analysis of a Piezo-based decoupled 3-DOF (XY?) micropositioner with large workspace

AU - Das, Tilok Kumar

AU - Shahrear, Rifat

AU - Shirinzadeh, Bijan

N1 - Conference code: 26th

PY - 2023

Y1 - 2023

N2 - This paper presents a piezo-based compliant planer 3-DOF micropositioning stage for decoupled large workspace of the platform. Three piezoelectric actuators inside three double-stairs bridge-type mechanisms were used to drive the output platform in XY? directions. A-3PPR type kinematic chain has been oriented parallelly in such a way to have a rotational symmetry about the centroid. Two different types of prismatic flexure joints with a passive rotary flexure joint were utilized in each kinematic chain. The proposed design focused on the redundancy of the cross-axis coupling effect from the other axes during directional movements. To evaluate the performance, Finite Element Analysis (FEA) has been conducted. The decoupled 3-DOF micropositioning stage is able to maintain the maximum parasitic motion of 0.05% and 1.95 % in the Y and ? directions of their respective directional working range. So, the effect of cross-coupling motion during directional movement can be presumed to be less in this case. Further, the FEA results show that the micropositioning stage has a large work envelope of ±271.1 µm × 235 µm × ± 6.0352 mrad. Moreover, the evaluation of the dynamic characteristics predicts that out-of-plane motion will be less likely to occur. Thus, the 3-DOF micropositioning stage can provide a unidirectional decoupled large range of motions.

AB - This paper presents a piezo-based compliant planer 3-DOF micropositioning stage for decoupled large workspace of the platform. Three piezoelectric actuators inside three double-stairs bridge-type mechanisms were used to drive the output platform in XY? directions. A-3PPR type kinematic chain has been oriented parallelly in such a way to have a rotational symmetry about the centroid. Two different types of prismatic flexure joints with a passive rotary flexure joint were utilized in each kinematic chain. The proposed design focused on the redundancy of the cross-axis coupling effect from the other axes during directional movements. To evaluate the performance, Finite Element Analysis (FEA) has been conducted. The decoupled 3-DOF micropositioning stage is able to maintain the maximum parasitic motion of 0.05% and 1.95 % in the Y and ? directions of their respective directional working range. So, the effect of cross-coupling motion during directional movement can be presumed to be less in this case. Further, the FEA results show that the micropositioning stage has a large work envelope of ±271.1 µm × 235 µm × ± 6.0352 mrad. Moreover, the evaluation of the dynamic characteristics predicts that out-of-plane motion will be less likely to occur. Thus, the 3-DOF micropositioning stage can provide a unidirectional decoupled large range of motions.

KW - Compliant mechanism

KW - Cross-coupling effect

KW - Decoupling

KW - Finite Element Analysis (FEA)

KW - Planer motion

UR - https://www.scopus.com/pages/publications/85187370446

U2 - 10.1109/ICCIT60459.2023.10441640

DO - 10.1109/ICCIT60459.2023.10441640

M3 - Conference Paper

AN - SCOPUS:85187370446

BT - 2023 26th International Conference on Computer and Information Technology, ICCIT 2023

PB - IEEE, Institute of Electrical and Electronics Engineers

T2 - International Conference on Computer and Information Technology 2023

Y2 - 13 December 2023 through 15 December 2023

ER -

Design and analysis of a Piezo-based decoupled 3-DOF (XY?) micropositioner with large workspace

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