Defect cluster recognition system for fabricated semiconductor wafers

Melanie Po-Leen Ooi, Hong Kuan Sok, Ye Chow Kuang, Serge Demidenko, Chris Chan

Research output: Contribution to journal › Article › Research › peer-review

55 Citations (Scopus)

Original language	English
Pages (from-to)	1029 - 1043
Number of pages	15
Journal	Engineering Applications of Artificial Intelligence
Volume	26
Issue number	3
DOIs	https://doi.org/10.1016/j.engappai.2012.03.016
Publication status	Published - 2013

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title = "Defect cluster recognition system for fabricated semiconductor wafers",

author = "Ooi, {Melanie Po-Leen} and Sok, {Hong Kuan} and Kuang, {Ye Chow} and Serge Demidenko and Chris Chan",

year = "2013",

doi = "10.1016/j.engappai.2012.03.016",

language = "English",

volume = "26",

pages = "1029 -- 1043",

journal = "Engineering Applications of Artificial Intelligence",

issn = "0952-1976",

publisher = "Elsevier",

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}

TY - JOUR

T1 - Defect cluster recognition system for fabricated semiconductor wafers

AU - Ooi, Melanie Po-Leen

AU - Sok, Hong Kuan

AU - Kuang, Ye Chow

AU - Demidenko, Serge

AU - Chan, Chris

PY - 2013

Y1 - 2013

U2 - 10.1016/j.engappai.2012.03.016

DO - 10.1016/j.engappai.2012.03.016

M3 - Article

SN - 0952-1976

VL - 26

SP - 1029

EP - 1043

JO - Engineering Applications of Artificial Intelligence

JF - Engineering Applications of Artificial Intelligence

IS - 3

ER -