Abstract
Selective Laser Melting (SLM) is steadily gaining acceptance across the manufacturing industry. Techniques for manufacturing components with complex geometries layer by layer have proven to be very effective in accelerating product development and hence reducing time to market. To build components by SLM from a nickel based super-alloy requires an understanding of process parameters and how they influence the microstructure, the degree of porosity and the properties. In this work, it was found that the as-fabricated density of parts manufactured from Hastelloy-X by SLM could be increased from 77 to 99 % by decreasing the laser scan speed, and that the degree of cracking can be reduced by decreasing the amount of minor alloying additions such as Mn and Si.
| Original language | English |
|---|---|
| Title of host publication | Proceedings of the Seventh International WLT Conference on Lasers in Manufacturing (LiM 2013) |
| Subtitle of host publication | Munich, Germany, May 13-16, 2013 |
| Editors | C. Emmelmann, M. F. Zaeh, T. Graf, M. Schmidt |
| Place of Publication | Amsterdam, Netherlands |
| Publisher | Elsevier |
| Pages | 823 - 827 |
| Number of pages | 5 |
| DOIs | |
| Publication status | Published - 2013 |
| Event | International WLT Conference on Lasers in Manufacturing (LiM) 2013 - Munich, Germany Duration: 13 May 2013 → 16 May 2013 Conference number: 7th http://www.proceedings.com/18836.html |
Publication series
| Name | Physics Procedia |
|---|---|
| Publisher | Elsevier BV |
| Volume | 41 |
| ISSN (Electronic) | 1875-3892 |
Conference
| Conference | International WLT Conference on Lasers in Manufacturing (LiM) 2013 |
|---|---|
| Abbreviated title | LiM 2013 |
| Country/Territory | Germany |
| City | Munich |
| Period | 13/05/13 → 16/05/13 |
| Internet address |
Keywords
- Selective laser melting
- Hastelloy-X
- Microstructure
- Optimised process parameters
Equipment
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Monash Centre for Electron Microscopy (MCEM)
Sorrell, F. (Manager) & Miller, P. (Manager)
Office of the Vice-Provost (Research and Research Infrastructure)Facility/equipment: Facility
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