Contact angle and volume retention effects from capillary bridge evaporation in biochemical microplating

Trang Diem Huynh, Murat Muradoglu, Oi Wah Liew, Tuck Wah Ng

Research output: Contribution to journalArticleResearchpeer-review

8 Citations (Scopus)
Original languageEnglish
Pages (from-to)647 - 655
Number of pages9
JournalColloids and Surfaces A: Physicochemical and Engineering Aspects
Volume436
DOIs
Publication statusPublished - 2013

Cite this

@article{955cc160314148f39b7a4edb33449862,
title = "Contact angle and volume retention effects from capillary bridge evaporation in biochemical microplating",
author = "Huynh, {Trang Diem} and Murat Muradoglu and Liew, {Oi Wah} and Ng, {Tuck Wah}",
year = "2013",
doi = "10.1016/j.colsurfa.2013.07.040",
language = "English",
volume = "436",
pages = "647 -- 655",
journal = "Colloids and Surfaces A: Physicohemical and Engineering Aspects",
issn = "0927-7757",
publisher = "Elsevier",

}

Contact angle and volume retention effects from capillary bridge evaporation in biochemical microplating. / Huynh, Trang Diem; Muradoglu, Murat; Liew, Oi Wah; Ng, Tuck Wah.

In: Colloids and Surfaces A: Physicochemical and Engineering Aspects, Vol. 436, 2013, p. 647 - 655.

Research output: Contribution to journalArticleResearchpeer-review

TY - JOUR

T1 - Contact angle and volume retention effects from capillary bridge evaporation in biochemical microplating

AU - Huynh, Trang Diem

AU - Muradoglu, Murat

AU - Liew, Oi Wah

AU - Ng, Tuck Wah

PY - 2013

Y1 - 2013

UR - http://www.sciencedirect.com.ezproxy.lib.monash.edu.au/science/article/pii/S0927775713005967

U2 - 10.1016/j.colsurfa.2013.07.040

DO - 10.1016/j.colsurfa.2013.07.040

M3 - Article

VL - 436

SP - 647

EP - 655

JO - Colloids and Surfaces A: Physicohemical and Engineering Aspects

JF - Colloids and Surfaces A: Physicohemical and Engineering Aspects

SN - 0927-7757

ER -