Contact angle and volume retention effects from capillary bridge evaporation in biochemical microplating

Trang Diem Huynh, Murat Muradoglu, Oi Wah Liew, Tuck Wah Ng

Research output: Contribution to journal › Article › Research › peer-review

9 Citations (Scopus)

Original language	English
Pages (from-to)	647 - 655
Number of pages	9
Journal	Colloids and Surfaces A: Physicochemical and Engineering Aspects
Volume	436
DOIs	https://doi.org/10.1016/j.colsurfa.2013.07.040
Publication status	Published - 2013

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title = "Contact angle and volume retention effects from capillary bridge evaporation in biochemical microplating",

author = "Huynh, {Trang Diem} and Murat Muradoglu and Liew, {Oi Wah} and Ng, {Tuck Wah}",

year = "2013",

doi = "10.1016/j.colsurfa.2013.07.040",

language = "English",

volume = "436",

pages = "647 -- 655",

journal = "Colloids and Surfaces A: Physicochemical and Engineering Aspects",

issn = "0927-7757",

publisher = "Elsevier",

}

TY - JOUR

T1 - Contact angle and volume retention effects from capillary bridge evaporation in biochemical microplating

AU - Huynh, Trang Diem

AU - Muradoglu, Murat

AU - Liew, Oi Wah

AU - Ng, Tuck Wah

PY - 2013

Y1 - 2013

UR - http://www.sciencedirect.com.ezproxy.lib.monash.edu.au/science/article/pii/S0927775713005967

U2 - 10.1016/j.colsurfa.2013.07.040

DO - 10.1016/j.colsurfa.2013.07.040

M3 - Article

VL - 436

SP - 647

EP - 655

JO - Colloids and Surfaces A: Physicochemical and Engineering Aspects

JF - Colloids and Surfaces A: Physicochemical and Engineering Aspects

SN - 0927-7757

ER -