Chipless RFID based high resolution crack sensing through SWB technology

Shuvashis Dey; Prasanna Kalansuriya; Nemai Chandra Karmakar

doi:10.1109/IMaRC.2014.7039040

Chipless RFID based high resolution crack sensing through SWB technology

Shuvashis Dey, Prasanna Kalansuriya, Nemai Chandra Karmakar

Electrical and Computer Systems Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference Paper › Research › peer-review

19 Citations (Scopus)

Original language	English
Title of host publication	2014 IEEE International Microwave and RF Conference (IMaRC)
Editors	K J Vinoy, K Ghorbani
Place of Publication	Danvers MA USA
Publisher	IEEE, Institute of Electrical and Electronics Engineers
Pages	330 - 333
Number of pages	4
ISBN (Print)	9781479963164
DOIs	https://doi.org/10.1109/IMaRC.2014.7039040
Publication status	Published - 2014
Event	IEEE MTT-S International Microwave and RF Conference 2014 - Bangalore, India Duration: 15 Dec 2014 → 17 Dec 2014 https://ieeexplore.ieee.org/xpl/conhome/7023176/proceeding (Proceedings)

Conference

Conference	IEEE MTT-S International Microwave and RF Conference 2014
Abbreviated title	IMaRC 2014
Country/Territory	India
City	Bangalore
Period	15/12/14 → 17/12/14
Internet address	https://ieeexplore.ieee.org/xpl/conhome/7023176/proceeding (Proceedings)

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10.1109/IMaRC.2014.7039040

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title = "Chipless RFID based high resolution crack sensing through SWB technology",

author = "Shuvashis Dey and Prasanna Kalansuriya and Karmakar, \{Nemai Chandra\}",

year = "2014",

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language = "English",

isbn = "9781479963164",

pages = "330 -- 333",

editor = "Vinoy, \{K J\} and K Ghorbani",

booktitle = "2014 IEEE International Microwave and RF Conference (IMaRC)",

publisher = "IEEE, Institute of Electrical and Electronics Engineers",

address = "United States of America",

note = "IEEE MTT-S International Microwave and RF Conference 2014, IMaRC 2014 ; Conference date: 15-12-2014 Through 17-12-2014",

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Dey, S, Kalansuriya, P & Karmakar, NC 2014, Chipless RFID based high resolution crack sensing through SWB technology. in KJ Vinoy & K Ghorbani (eds), 2014 IEEE International Microwave and RF Conference (IMaRC). IEEE, Institute of Electrical and Electronics Engineers, Danvers MA USA, pp. 330 - 333, IEEE MTT-S International Microwave and RF Conference 2014, Bangalore, India, 15/12/14. https://doi.org/10.1109/IMaRC.2014.7039040

Chipless RFID based high resolution crack sensing through SWB technology. / Dey, Shuvashis; Kalansuriya, Prasanna; Karmakar, Nemai Chandra.
2014 IEEE International Microwave and RF Conference (IMaRC). ed. / K J Vinoy; K Ghorbani. Danvers MA USA: IEEE, Institute of Electrical and Electronics Engineers, 2014. p. 330 - 333.

Research output: Chapter in Book/Report/Conference proceeding › Conference Paper › Research › peer-review

TY - GEN

T1 - Chipless RFID based high resolution crack sensing through SWB technology

AU - Dey, Shuvashis

AU - Kalansuriya, Prasanna

AU - Karmakar, Nemai Chandra

PY - 2014

Y1 - 2014

UR - http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=7039040

UR - https://www.scopus.com/pages/publications/84924973381

U2 - 10.1109/IMaRC.2014.7039040

DO - 10.1109/IMaRC.2014.7039040

M3 - Conference Paper

SN - 9781479963164

SP - 330

EP - 333

BT - 2014 IEEE International Microwave and RF Conference (IMaRC)

A2 - Vinoy, K J

A2 - Ghorbani, K

PB - IEEE, Institute of Electrical and Electronics Engineers

CY - Danvers MA USA

T2 - IEEE MTT-S International Microwave and RF Conference 2014

Y2 - 15 December 2014 through 17 December 2014

ER -

Chipless RFID based high resolution crack sensing through SWB technology

Conference

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