Abstract
The application of a structured neural network controller to the dispensing of adhesive in the manufacture of mixed technology surface mount boards is discussed in this paper. Following an outline of the adhesive dispensing system and the various process faults that can occur in operation, the determination of a simple model of the system using standard system identification techniques is discussed. A controller is derived by mapping the control and fault diagnosis requirements onto a neural network architecture specifically designed to represent the adhesive dispensing process characteristics. The dispensing system response to the controller is given along with a comparison of the timing performance of the neural network with conventional proportional, integral and derivative (PID), rule based and fuzzy logic controllers.
Original language | English |
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Title of host publication | Manufacturing Aspects in Electronic Packaging |
Editors | K.F. Ehmann |
Publisher | American Society of Mechanical Engineers (ASME) |
Pages | 107-118 |
Number of pages | 12 |
Volume | 65 |
ISBN (Print) | 0791810321 |
Publication status | Published - 1993 |
Externally published | Yes |
Event | Proceedings of the 1993 ASME Winter Annual Meeting - New Orleans, United States of America Duration: 28 Nov 1993 → 3 Dec 1993 |
Conference
Conference | Proceedings of the 1993 ASME Winter Annual Meeting |
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Country/Territory | United States of America |
City | New Orleans |
Period | 28/11/93 → 3/12/93 |