Benchmark of intelligent control techniques for surface mount technology (SMT) adhesive dispensing: Process overview and the application of a structured neural network controller

A. A. West, David J. Williams, C. J. Hinde, C. H. Messom

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Abstract

The application of a structured neural network controller to the dispensing of adhesive in the manufacture of mixed technology surface mount boards is discussed in this paper. Following an outline of the adhesive dispensing system and the various process faults that can occur in operation, the determination of a simple model of the system using standard system identification techniques is discussed. A controller is derived by mapping the control and fault diagnosis requirements onto a neural network architecture specifically designed to represent the adhesive dispensing process characteristics. The dispensing system response to the controller is given along with a comparison of the timing performance of the neural network with conventional proportional, integral and derivative (PID), rule based and fuzzy logic controllers.

Original languageEnglish
Title of host publicationManufacturing Aspects in Electronic Packaging
EditorsK.F. Ehmann
PublisherAmerican Society of Mechanical Engineers (ASME)
Pages107-118
Number of pages12
Volume65
ISBN (Print)0791810321
Publication statusPublished - 1993
Externally publishedYes
EventProceedings of the 1993 ASME Winter Annual Meeting - New Orleans, United States of America
Duration: 28 Nov 19933 Dec 1993

Conference

ConferenceProceedings of the 1993 ASME Winter Annual Meeting
Country/TerritoryUnited States of America
CityNew Orleans
Period28/11/933/12/93

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