An integrated model for adjustment of process parameters to recover throughput shortage in semiconductor assembly: a case study

Ho Kok Hoe; Joshua Prakash; Ong Kok Seng

An integrated model for adjustment of process parameters to recover throughput shortage in semiconductor assembly: a case study

Ho Kok Hoe, Joshua Prakash, Ong Kok Seng

Research output: Contribution to conference › Paper

Original language	English
Publication status	Published - 27 Jan 2019
Externally published	Yes
Event	UTAR FSc and FEGT Postgraduate Colloquium 2019: Towards Innovative Research in Science and Engineering - Universiti Tunku Abdul Rahman, Kampar, Malaysia Duration: 26 Jan 2019 → 27 Jan 2019

Conference

Conference	UTAR FSc and FEGT Postgraduate Colloquium 2019
Country/Territory	Malaysia
City	Kampar
Period	26/01/19 → 27/01/19

1 Article

An integrated model for adjustment of process parameters to recover throughput shortage in semiconductor assembly: A case study
Hoe, H. K., Prakash, J., Kamaruddin, S. & Seng, O. K., 2019, In: Journal of Industrial Engineering and Management. 12, 2, p. 340-355 16 p.
Research output: Contribution to journal › Article › Research › peer-review

Open Access
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1 Citation (Scopus)

Cite this

@conference{92f47a8883034d9fa6affe9e72f3c3a4,

title = "An integrated model for adjustment of process parameters to recover throughput shortage in semiconductor assembly: a case study",

author = "{Kok Hoe}, Ho and Joshua Prakash and Seng, {Ong Kok}",

year = "2019",

month = jan,

day = "27",

language = "English",

note = "UTAR FSc and FEGT Postgraduate Colloquium 2019 : Towards Innovative Research in Science and Engineering ; Conference date: 26-01-2019 Through 27-01-2019",

}

An integrated model for adjustment of process parameters to recover throughput shortage in semiconductor assembly: a case study

Conference

Research output

An integrated model for adjustment of process parameters to recover throughput shortage in semiconductor assembly: A case study

Cite this