In this paper, a method of preparing ultra-compact MLCC is introduced. The BaTiO3 dielectric layers were prepared by sol–gel technology and the Ag electrode layers were achieved via magnetron sputtering technology. The method of laser etching was adopted to achieve the pattern of electrode layer instead of stencil printing and photoetching and a special sintering process was used to make the ideal thickness and effectively prevent delamination. Through the above method, MLCCs with the monolayer thickness less than 200 nm and the dimensional accuracy below 0.1µm have been able to successfully make. And by testing the relationship between capacitance and loss with temperature and frequency, the reliability of the simple sample had been proved preliminarily. The study offers a new method for the preparation of miniaturizing MLCCs, which is more effective and lower costs.
|Number of pages||5|
|Journal||Journal of Materials Science: Materials in Electronics|
|Publication status||Published - Mar 2017|