A triple integration timing scheme for SPAD time of flight imaging sensors in 130 nm CMOS

Daniel Morrison, Simon Kennedy, Dennis Delic, Mehmet Yuce, Jean-Michel Redoute

Research output: Chapter in Book/Report/Conference proceedingConference PaperResearchpeer-review

2 Citations (Scopus)

Abstract

This paper presents a triple integration time-to-amplitude conversion (TAC) scheme for high resolution SPAD time of flight cameras. Two reference integrators are added to the conventional integration based TAC design, allowing the scheme to be resistant to PVT variation, common mode noise and capacitive discharge. An implementation in 130 nm CMOS is presented with experimental validation to show a significant improvement over the traditional single integration scheme. The measured performance shows that the triple integration interpolator has an INL, DNL and RMS jitter of 85.1 ps, 43 ps and 65 ps respectively.

Original languageEnglish
Title of host publication2018 25th IEEE International Conference on Electronics Circuits and Systems (ICECS)
EditorsElena Blokhina, Francois Rivet
Place of PublicationPiscataway NJ USA
PublisherIEEE, Institute of Electrical and Electronics Engineers
Pages13-16
Number of pages4
ISBN (Electronic)9781538695623
ISBN (Print)9781538691168
DOIs
Publication statusPublished - 2018
EventIEEE International Conference on Electronics, Circuits and Systems 2018 - Bordeaux, France
Duration: 9 Dec 201812 Dec 2018
Conference number: 25th

Conference

ConferenceIEEE International Conference on Electronics, Circuits and Systems 2018
Abbreviated titleICECS 2018
CountryFrance
CityBordeaux
Period9/12/1812/12/18

Keywords

  • Single Photon Avalanche Diode (SPAD)
  • Time-of-Flight (ToF)
  • Time-to-Amplitude Conversion (TAC)
  • Timing

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