A model for the grain size dependent work hardening of copper

C. W. Sinclair, W. J. Poole, Y. Bréchet

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Abstract

A model is proposed for the low temperature tensile response of copper polycrystals with grain sizes in the range of 2-50 μm. The initial work hardening behaviour is strongly grain size dependent and is considered to arise from a combination of kinematic and isotropic hardening due to dislocation-grain boundary interactions. At larger strains, the influence of grain size on work hardening disappears owing to processes associated with dynamic recovery at boundaries.

Original languageEnglish
Pages (from-to)739-742
Number of pages4
JournalScripta Materialia
Volume55
Issue number8
DOIs
Publication statusPublished - Oct 2006
Externally publishedYes

Keywords

  • Copper
  • Grain boundaries
  • Internal stresses
  • Work hardening

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